Used SHIBAURA TFC-3000 #293751829 for sale

SHIBAURA TFC-3000 is a die attacher specifically designed for attaching semiconductor die onto a substrate. This machine is capable of performing this task at high accuracy and speed, making it an ideal product for any die-bonding technology. This machine is equipped with several features that make it unique. One of the most prominent features of SHIBAURA TFC 3000 is its ultra-precise positioning equipment. This system works by using an advanced laser unit to accurately measure and detect the position of the die to be attached. Additionally, the machine is equipped with a high precision die gripper and four precision collet holders that can carefully position the die within a few tenths of a millimeter. TFC-3000 also comes with an integrated solder paste dispensing machine. This tool is specifically designed for attaching dies that require soldering. Through its automated process, the solder paste dispensing asset is capable of accurately dispensing solder paste onto the die without splashing. Additionally, the dispensing model can be set to a few different patterns, allowing engineers to customize the process. TFC 3000 also comes with a built in vision equipment. This system utilizes cameras and image recognition algorithms to inspect, verify, and repair defective dies. Furthermore, this unit allows engineers to precisely locate and manipulate the die with great accuracy. Additionally, the vision machine can be customized to fit different tasks, providing flexibility and versatility. Finally, SHIBAURA TFC-3000 has a built in die bonding tool. This asset is capable of die bonding different types of dies onto a substrate. It utilizes advanced robotics to securely attach dies in an efficient manner, making it an excellent choice for high-volume production runs. Overall, SHIBAURA TFC 3000 is an impressive die attacher that is equipped with a variety of features that make it a great choice for any manufacturing technology. Its accurate positioning model, solder paste dispensing equipment, vision system, and die bonding unit make TFC-3000 an ideal choice for die attachment in semiconductor manufacturing.