Used SHIBAURA TFC-3000 #293778297 for sale

SHIBAURA TFC-3000
Manufacturer
SHIBAURA
Model
TFC-3000
ID: 293778297
Flip chip bonders Loader and unloader.
SHIBAURA TFC-3000 is a die attacher that is widely used in manufacturing processes requiring accurate and reliable die attachment. The attacher features an efficient and robust design that can be operated in either manual or automatic mode. It is capable of die sizes ranging from 0.03 to 38 mm, with a die thickness of 0.1 - 0.5 mm, and can handle various substrate materials with a minimum temperature of 20°C. This makes it suitable for many complex applications. SHIBAURA TFC 3000 has a number of features designed to ensure maximum fidelity when attaching parts to a substrate. It uses a highly accurate force control system to exert controlled pressure on the parts which ensures a consistent and reliable attachment process. Additionally, the attacher has a self-learning feature which allows it to detect any fluctuations in temperature and adapt accordingly, further leading to a successful outcome. TFC-3000 is equipped with an intuitive touch panel which allows the operator to easily manage and control the attacher's functions. It provides detailed information such as data collection and set-up parameters and offers a variety of preset patterns including straight line, circular and diamond patterns. Additionally, it is equipped with an automatic error-checking system which will detect any errors and display them on the panel. TFC 3000 is highly compatible with a range of other equipment used in the manufacturing industry, making it easy to integrate into existing systems. It is also relatively lightweight at only 10kg and is compatible with remote operation and can be connected to a PLC for more complex processes. Overall, SHIBAURA TFC-3000 is an effective and reliable die attacher designed for use in the manufacturing industry. Its efficient design and intuitive features make it easy for operators to use and provides consistent, reliable results for a wide range of die sizes and substrates.
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