Used SHIBAURA TFC-3600 #293669847 for sale

SHIBAURA TFC-3600 die attach machine is designed to provide high-performance die bonding. Its advanced equipment technology and automated processes guarantee high reliability, accuracy, and ease of use. TFC-3600 is an ideal solution for die attach applications in thermal control, laser, and optoelectronic applications. SHIBAURA TFC-3600 system uses advanced technology to accurately attach flip chip die to substrates. Its three-axis motion control of X, Y, and Z provides high repeatability, while its four-zone oven ensures maximum heating efficiency. It also features a 220V AC power supply for reliable thermal control. TFC-3600 has a 33mm X 33mm working area with an adjustable substrate table height. Its work station contains five returnable loops of die feeders and substrate cages. SHIBAURA TFC-3600 has an on-board safety warning unit with alarms for over-temperature, pressure, and other potential risks. The machine is also equipped with a tool vision software, which offers detailed diagnostics and an easy-to-use interface. TFC-3600 asset is compatible with different types of die sizes and can achieve maximum precision. Its auto-calibration and shadow reduction functions ensure that the die attach process is performed in the most precise way possible. Its automated functions make repetitive tasks easier and save time without compromising quality. SHIBAURA TFC-3600 offers advanced features such as automated vision inspection, advanced vision alignment, automatic die shearing, in-process bond verification, and much more to help ensure the highest quality with the least amount of effort. It also features electrostatic discharge protection to prevent any damage to the printed circuit boards. TFC-3600 is designed for reliable operation in continuous production environments. It is energy efficient, using only the energy needed for the bond process, and is designed to meet the highest quality standards with minimal maintenance. It is an ideal solution for both small- and large-scale die attach applications.