Used SHIBAURA TFC-FB1C #9379882 for sale
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ID: 9379882
Vintage: 2003
Flip chip bonders
Bonding accuracy: 10～490 N
Accuracy load: Multi stage control
High parallelism:
Individual backup stage
Pressurization part
Tool part separation system
Versatility: (4) Units, (8) heads
Easy operation: Color touch panel
Signal tower
Front cover
Switch panel
Driver box
Controller box
Touch screen
Unloader
Main power switch
Bonding head: Left and right
Indexer
Bonding stage: Left and right
Teflon tape supply machine
Substrate feeder
New magazine input tray
Magazine supply pusher
Magazine elevator
Discharge magazine output tray
Pressure sensor:
Positive pressure / Base
Negative pressure / Base
Temperature controller: Left and right
Load cell amp:
Left head
Right head
MO Driver
Operation panel:
Touch panel
Switch panel
Signal tower
Flicker buzzer
Sensors:
Cover sensor
Air pressure
Vacuum pressure
Light
Air unit
Power supply: AC, 200/220Ｖ, ±10％, 3 Phase, 50/60 Hz
Power consumption: 2 kVA
Compressed dry air: 0.5 MPa (150 liter / min)
Vacuum: Over -80 kPa (100 liter / min)
2003 vintage.
SHIBAURA TFC-FB1C is an automated die attacher, specifically designed for use in die attach processes in the electronics industry. It is an advanced piece of machinery composed of intricate components, engineered with precision to complete complex tasks quickly and accurately. TFC-FB1C uses a camera-based equipment to accurately detect and pick die from the reel and place them onto the mounting surface accurately. It features a belt-driven motor system for smooth and precise positioning and transport of the die. The large work space allows for easy and efficient handling of die sizes ranging from 0.2mm up to 3.2mm in thickness, as well as die sizes between 20mm up to 300mm in length. The unit is also capable of accommodating die heights between 0.3mm up to 5.0mm. SHIBAURA TFC-FB1C is equipped with a sensitive vision machine with 2X and 3X digital zoom capabilities. It also features a stereo vision tool with up to 0.1 micron accuracy that allows for precise placement and alignment of the die. The asset is highly accurate and optimized for fast operation with minimal reject rate. It also includes a nozzle-mounted camera for monitoring of solder quality and prevent solder bridging. The control model of TFC-FB1C is composed of a touch panel and a PLC controller. The touch panel allows for easy adjustment and operation of the equipment, as well as monitoring of various machine parameters and data logging. This digital user interface also makes troubleshooting easier and faster. The PLC controller provides enhanced system stability, reliability and accuracy by providing accurate control of all components in the unit. SHIBAURA TFC-FB1C is a compact, flexible and easy to use die attacher designed to provide quick and accurate die placement in the electronics industry. It features a precise vision machine with digital zoom, stereo vision, and a nozzle-mounted camera to maximize accuracy and prevent solder bridging. Its PLC control tool provides enhanced asset stability, allowing for efficient, reliable operation. Whether you're in need of quick and accurate die placement or a reliable piece of machinery, TFC-FB1C is an excellent choice.
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