Used SHINKAWA SPA-300 #9080854 for sale

SHINKAWA SPA-300 die attacher is a state-of-the-art die bonding machine. This die attacher is widely used in the semiconductor and microelectronics industries for the precise attachment of various silicon chips and components. SHINKAWA SPA 300 is equipped with a high speed pick and place head, a heated die station, and accurate XYZ die placement accuracy. The heated die station is capable of accurately positioning the semiconductor die in the exact location during attachment. The pick and place head provides double sided bonding, making it ideal for packaging applications requiring accurate product joining. SPA-300 is designed with a variety of accessories to meet various customer needs. SHINKAWA patented 'die to die' stabilization technology ensures precision lead frame placing for higher yields and significant throughput. A special filter system helps to reduce contamination, while the profiled heaters allow the die attacher to easily customize the temperature and time setting for each application type. Additional features such as a vacuum station, touchscreen monitor, flux pump, and optical microscope further enhance SPA 300's performance. SHINKAWA SPA-300 is a versatile die attacher that eliminates manual die placement and offers excellent die-to-die stabilization. Its user-friendly interface makes the setup process easy to understand and the machine extremely easy to operate. This die attachment system is well suited for higher volume production, enabling increased production efficiency and excellent yields. One of the key advantages of SHINKAWA SPA 300 is its high-speed capabilities; providing fast cycle times with accurate placement of dies at every step. SPA-300 is a reliable machine that is highly capable of bonding a variety of silicon chips with superior bonding quality. Its efficient design and features make it ideally suited for demanding performance and reliability. Its advanced design ensures that it will consistently meet the needs of customers in the semiconductor and microelectronics manufacturing fields.