Used SHINKAWA SPA-300 #9283964 for sale

SHINKAWA SPA-300 is a die attach machine that fully automates the process of attaching a die into an IC package. This machine is designed to maximize yields, minimize defects and increase speed and efficiency in die attachment. SHINKAWA SPA 300 can be used for any type of die attach, from pre-stamping to vacuum assisted Ultrasonic Die Attachment (UDAT). SPA-300 offers a wafer vision system for maximum accuracy and repeatability, which can detect wafers with accuracy as small as 5 microns. The nozzle tilt control helps ensure that the correct amount of pressure and force are applied to the die for proper attachment. The machine also features a pressure sensor, temperature controller, and automatically controlled parameters for uniform and consistent results. SPA 300 is capable of servicing multiple types of packages, such as chip on board (COB), flat pack, and topless package dies. It offers an automated material handler to ensure that the correct wafers and dies are delivered to the machine in a timely fashion, and can be easily integrated with other tools and equipment. SHINKAWA SPA-300 also offers a total of 12 on-board shuttle compartments, allowing operators to store different wafer sizes and reduce the time taken to switch between wafers. It has an optional LCD touch panel with English language support, making it easy to use for global teams. The machine also has adjustable feeders and vacuum pressure manifolds for precise and reliable die attachment. Overall, SHINKAWA SPA 300 is an advanced die attach machine that offers a wide range of features to ensure accuracy and reliability in die attachment. It is designed to increase speed and efficiency while also minimizing defects in the process. The machine is capable of servicing multiple types of packages resulting in improved yields and reduced cycle times. Operators benefit from several support systems that make the die attach faster and more reliable.