Used SHINKAWA SPA-400 #293639126 for sale

SHINKAWA SPA-400 is a precision die attacher that is used to attach dies to substrates with utmost accuracy. It is designed for the attachment of various dies ranging from chip, flip-chip, BGA, and CSP packages up to diameter of 25 millimeters; height up to 7 millimeters, and weight up to 1 gram. SPA-400 guarantees reliable, repeatable, and accurate die placement with a positional accuracy of 1 micron. It uses an X-Y gantry system with a computer-controlled servo motor to accurately move and position the die. In addition, there are four "Z-Axis" positioners that adjust the die height and pressure. The machine also utilizes a vacuum pen for die pick-up and delivery. The user interface is composed of a liquid crystal touch screen display and various switches and knobs, allowing for easy operation and adjustment. SHINKAWA SPA-400 also offers several optional functions, including solder-paste selection, photo alignment, and accuracy verification. Its robust construction ensures stable die placement across a wide range of operating conditions. The machine is equipped with a temperature control system that maintains a constant temperature around the die and substrate, ensuring reliable and accurate performance. SPA-400 also offers various safety features, including an air filter, dust monitor, and over-current protection. SHINKAWA SPA-400 is reliable and easy to use. It is widely used by leading semiconductor companies, research institutes, and universities, and is highly regarded for its precision and performance. It is also highly customizable and can be adjusted to meet the needs of any application. Compared to other die-attaching machines, SPA-400 is a cost-effective option that provides reliable and accurate die placement.