Used SHINKAWA SPA-400 #9119680 for sale

SHINKAWA SPA-400 is a manual die attach machine designed to quickly and conveniently attach flat die or any other small component securely onto various substrates. The machine features an ergonomic handwheel with adjustable speed for precise control of the process. Additionally, the temperature can be precisely adjusted for optimal chip bonding. SPA-400 is designed for manual pick and place that ensures uniform bonding quality with various substrate sizes and shapes. It is equipped with two independent vision monitoring systems for optimal performance and for ensuring component alignment during attachment. The equipment utilizes an X-Y-V-T TABLE to accurately move and position die for precise bonding. The drive system on the X-Y table offers superior control, ensuring accuracy during placement. It is also compatible with both automatic and manual die registers, enabling die-to-substrate alignment with minimal operator intervention. The advanced micro-pneumatic unit provides powerful pocket suction capabilities with a highly adjustable air flow. This machine provides precise pressure control for the pick-up, placement, and bonding of die onto various substrates. It also offers controllable speed and adjustable suction force for precise die manipulation and placement. SHINKAWA SPA-400 is also equipped with safety features such as a safety bar and a warning alarm to alert the operator of any hazardous situation. Plus, the high-power LED light provides adjustable intensity and height settings to clearly illuminate the working benchtop. SPA-400 also has a compact design which allows easy integration into existing production lines. SHINKAWA SPA-400 is an ideal solution for high-volume die bonding applications and offers superior accuracy, consistency, and speed for precise and reliable die bonding. It is the perfect choice for high volume and reliable die bonder operations and is designed to deliver high quality performance with every use.