Used SHINKAWA SPA-400 #9218799 for sale

SHINKAWA SPA-400
Manufacturer
SHINKAWA
Model
SPA-400
ID: 9218799
Vintage: 2008
Die bonder 2008 vintage.
SHINKAWA SPA-400 is a beading type die attaching robot arm designed specifically for use in the semi-conductor industry. It is used to attach dice of various sizes to packages using an adhesive such as solder paste. The robot arm has a unique construction with a fixed base that houses the servomotor and a series of linear actuators that position the robot arm. The control of the robot arm is made possible through the use of a dedicated software package which allows the operator to define patterns for the beading process. The robot arm is comprised of an outer ring which is mounted on the base; this ring houses the motors and linear actuators that control the robot arm's motion. The robot arm supports 4 degrees of freedom with a 1 degree of freedom in the vertical direction. The arm is driven by a servo motor along with limit switches to monitor the position and direction of the arm. The robot is additionally equipped with a cermet bonding head that is used to deposit the adhesive onto the die to be attached. This head is programmable and allows the operator to make adjustments to the amount of adhesive to be used and the pattern to be used. SPA-400 also includes an accurate vision equipment that can detect the die's position and dimensions. This system is made up of an apertured lens, high quality CCD camera, programmable light source, and image analysis software. With this unit and a defined beading program, the operator can deposit the adhesive at precise locations. Finally, SHINKAWA SPA-400 is equipped with a vacuum machine that is used to secure and carry a tray of die during the beading process. This vacuum tool is managed by an electronic control box which allows for steady operation. Overall, SPA-400 is a reliable and easy to use robot arm used specifically for die attaching. Its accurate vision asset combined with the robust construction and high-quality software package makes it a valuable tool for the semiconductor industry.
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