Used SHINKAWA SPA-400 #9378345 for sale

SHINKAWA SPA-400 is a die attach machine developed by SHINKAWA, a leader in the micro-electronic packaging industry. It is designed to attach packaged electrical components to printed circuit boards in a precise and accurate manner. SPA-400 uses a hybrid die attachment method that employs both heat and epoxy to ensure reliable bond integrity. It features a compact footprint and a range of positioning stages, enabling fast and efficient production. The system consists of four main components - a controller, a die bonder, a die attach head, and an alignment stage. SHINKAWA SPA-400 utilizes a three-axis motor-driven alignment stage to ensure precise placement of the components on the printed circuit board. The epoxy and heat based die attach head is capable of accurate repeatability of 0.05mm and a maximum height of 50mm. The die bonder provides precise control over the die attach process, allowing for easy setup and adjustment to accommodate different size components. It is equipped with a high-speed thermal monitor to ensure stable die attach temperatures. SPA-400 is designed with user-friendly software and intuitive controls for easy operation and maximum efficiency. It features a graphical interface to show the locations of the components on the board, enabling easy verification of the die attach process. For added convenience, the system can also be programmed to store multiple boards and die attach processes in memory, eliminating the need for re-setups for each job. SHINKAWA SPA-400 is a proven choice for manufacturers looking for reliable and accurate die bonding with the ability to handle a wide range of components. It is fully compatible with Lead-Free assembly processes and also offers connectivity to diagnostic tools such as X-ray imaging and vision systems. With its advanced technology, SPA-400 provides the perfect combination of accuracy, production speed, and affordability.