Used TORAY SP 500BW #9260847 for sale

TORAY SP 500BW is a die attach equipment designed for high-quality, high-precision bonding in the electronics and semiconductor industries. It is a fully-automatic flip chip die attach machine that is used for attaching die to substrates using flip-chip, die-attach film adhesives, and solder paste. This system is ideal for a wide variety of bonded products including consumer electronics, automotive, and medical devices. SP 500BW offers various functional features that have been optimized to ensure optimal bonding performance and quality. It features an advanced flip-chip die attach mechanism with roll wheel head design, which offers high accuracy, repeatability, and repeatability accuracy. The die attach unit is equipped with advanced vision and image processing systems that improve its accuracy and minimize the need for manual inspection of the die. The machine also features an improved robot wafer arm with up to 8 axes, which can reach various angles of the die and substrate to enable precise alignment. It also features an advanced dispenser tool for accurate adhesive application, as well as an auto cleaning asset for reducing any contaminants from the die surface. The automatic adjuster model allows for the machine to be adjusted to the exact size of the die required. The equipment comes with a variety of control software options for maximum process flexibility and safety. The 'Flip Chip' module allows for one-step, automated flip chip die attach, and the 'Solder Paste' module offers the option for sequential soldering. Furthermore, the machine is capable of being linked to an external machine vision system for accurate verification in difficult-to-access areas. TORAY SP 500BW provides an ideal solution for a range of processes requiring high-sequence accuracy, repeatability, and overall bonding performance. It is a versatile unit that can be used across the electronics and semiconductor industries, and is suitable for a wide range of bonded products. Thanks to its optimized functional features and easy-to-use control software, it is the perfect choice for any die attach application.