Used TORAY SP 500BW300 #9239645 for sale

TORAY SP 500BW300 is a die attacher manufactured by Japanese firm TORAY Industries. It is designed to efficiently attach dies used in semiconductor packaging to lead frames. SP 500BW300 is a high-precision die attacher capable of both standard and fine-pitch thick film die bonding. The die attach machine is automated and runs on a fully CNC programmable system, allowing for precise control of placement, die accuracy, die attach time, and other operating settings. The unit features a dual arm configuration, with one arm taking care of realignment and the other bonding the die in place. The die attachment is done through a heated conditioning process, which uses infrared light to ensure even heating throughout the whole die area. TORAY SP 500BW300 features a very accurate process and repeatable assembly that reduces the time and cost of producing the packaged device. The unit is also very easy to use and program, due to the use of a touch screen interface with an intuitive menu. SP 500BW300 can accept both single and multi-tile dies, with an optional, programmable, 3-dimensional tile shifting function. The machine also features an alignment accuracy of 0.2mm or less and a die attach force of up to 30kg (66lbs). The maximum die size that can be mounted is 7x7 mm, making it suitable for the majority of integrated circuit design packages. TORAY SP 500BW300 comes with a 2-year warranty and is fully supported with a team of experienced technicians. In addition, the machine is energy-efficient, reducing waste and assuring optimal energy performance for the die attachment process. Overall, SP 500BW300 is an ideal machine for the manufacture of all kinds of semiconductor packages. With its high accuracy and repeatable performance, it ensures cost efficiency for its operators and is a reliable and efficient die attacher.