Used TORAY SP 500BW300 #9266630 for sale

TORAY SP 500BW300 is a state-of-the-art die attacher, designed to provide continuous, reliable performance in high-volume die attaching applications. It features a 500 boat slot capacity, 300 nozzles, and a wide range of appliqué head sizes. The innovative design of SP 500BW300 makes it easy to use and highly efficient, providing superior cycle times and excellent dot accuracy. TORAY SP 500BW300 is designed to efficiently handle large volumes of die-bonding applications. It is ideal for attaching thin-film components, such as discrete and integrated circuits, to external substrates. Its flexible design can accommodate media and substrates that range from 3.8mm to 9.9mm in thickness. It can also be configured with multiple head sizes, ranging from 0.3mm to 0.5mm. Additionally, the equipment can accurately and quickly adjust wires when necessary. SP 500BW300 features an array of outstanding features that make it an ideal choice for die attaching. It is powered by a next-generation servo system that can process multiple boards simultaneously, reducing overall cycle time. It includes a robust, intuitive user interface that enables users to quickly understand the programming and operation of the unit. There is also a LCD monitor for users to view the parameters, enabling quick diagnosis of any issues. TORAY SP 500BW300 also incorporates a prisma board, which aids in alignment and accuracy while bonding. To ensure safety, SP 500BW300 includes several fail-safe mechanisms including a media pressure regulator, head vacuum relief valve, and no-load protection, for preventing overload. Its modular design allows users to easily upgrade and customize the machine, enabling them to easily meet their exact application needs. TORAY SP 500BW300 is an ideal choice for high-volume die attaching applications. It is reliable, efficient, and designed to minimize cycle time while optimizing accuracy. The tool includes a variety of robust features that make it a cost-effective and reliable solution for many die attaching applications. Its intuitive user interface and robust features make it a powerful and versatile asset that can efficiently handle a wide range of mediums and substrates.