Used TOSOK DBD 4600 #9395667 for sale

TOSOK DBD 4600 is a die attacher designed for high-precision, advanced IC processes. This advanced die attacher allows for highly precise placement of dies for improved data reliability and performance across all types of integrated circuits. It is an ideal solution for many of today's most advanced technologies. DBD 4600 features an XY die taping equipment. This system is designed to ensure precise location data and orientation of the die within the package, as well as the adhesive that holds them in place. Additionally, the unit can interface with a Software for Effective Rotation (SOFER) program that allows operators to accurately adjust the pre-programmed rotation of the die before it is attached. The rotation adjustment helps to ensure the die is correctly positioned for further IC processing. TOSOK DBD 4600 operates under a vacuum, which is adjustable and can reach precisions up to four ten-thousandths of a millimeter. The attached die is then transcribed onto the surface of the IC package using a UV laser beam. This allows for a uniform and smooth surface finish, and can achieve greater heat dissipation performance. The machine also features integrated high-speed counting electrodes that count the attached die at any given point. This enables operators to inspect the transmittance of the UV laser beam and ensure precise placement of the dies within the IC package. Additionally, the electrodes can analyze the die's electrical properties to ensure it was properly placed. DBD 4600 has a number of other features designed to make its operation as efficient as possible, such as its Process Monitoring Tool (PMS). The PMS stores and monitors the packaging process results, and allows for the adjustment of the parameters to ensure consistent results. Additionally, the asset has a No-Go Autostander function that is designed to reject defective dies that do not meet quality standards. Overall, TOSOK DBD 4600 is an advanced die attacher for high-precision IC processing. Its features offer superior accuracy and reliability as well as improved heat dissipation performance. As a result, it is ideal for any operation that requires precision die placement in integrated circuit packages.