Used YAMADA TQFP #293647436 for sale

YAMADA TQFP (Thin Quad Fine Pitch) is a state-of-the-art die attacher designed specifically for attaching small, fine pitch devices. It is suitable for a wide range of chip sizes and package types in both manual and automated environments. TQFP is capable of fine pitch mounting ranging from 0.5 mm up to 1.8 mm pitch with a reliable alignment accuracy of ± 50 μm or better. This attacher uses a 4-stage process to attach the dies securely to their substrate or pad. The first stage involves the pick-and-place assembly of the dies. It utilizes a vacuum-based flip-chip picker with a range of up to three-axis motion for easy die placement and alignment. This stage will ensure accurate die placement within ± 50 μm of the center of the package. The second stage consists of a solder paste application by an automated add-on dispenser for accurate and repeatable output. This stage also utilizes a 12-pin micro-tip precision applicator to ensure consistent flux deposition. The third stage is the reflow process which is done by a single-zone reflow oven, maintaining minimum temperatures necessary for a successful reflow. This stage is safe for all types of packages and takes roughly 15 minutes to complete. The fourth and final stage is the heat-stake process, which is done by a precision heat-staking tool to secure the package to its substrate. Overall, YAMADA TQFP has superior accuracy and reliability compared to other die attach systems. It uses modern digital technology and advanced programming to develop an automated die-attaching system suitable for the most demanding applications. With its high-precision alignment accuracy, TQFP is an excellent choice for any assembly and packaging requirement.