Used YAMADA TQFP #293647442 for sale

YAMADA TQFP is an automated die attacher that can provide accurate placement of die packages with its advanced vision-based technology. This advanced die attacher uses a vision equipment to detect the die package before mounting it on the substrate. The vision system is programmed with die sizes and locations, so the attacher will place each die package accurately. The advanced features of this die attacher can ensure that each die package is placed within 0.3mm accuracy. In order to ensure accurate placement of the die packages, TQFP die attacher uses state-of-the-art camera technology. The vision unit consists of an overhead camera, which can detect the size, shape and positioning of the die package. The data from the vision machine is then processed by a micro-controller to ensure the successful placement of the die package on the substrate. The die attacher is equipped with an advanced actuator, which can accurately position the die package for mounting. The actuator is connected to the vision tool and it is programmed to move the die package in a specific direction and angle to ensure accurate placement on the substrate. This advanced asset also provides repeatability in placement of the die package, allowing for the same product to be manufactured multiple times with the same results. YAMADA TQFP is also equipped with a wide array of safety features. These safety features can detect and stop any movements, which could lead to harm or damage to the die packages. The die attacher also contains an emergency stop model, which can be activated in case of any issue during die placement. Overall, TQFP die attacher is an advanced die attaching equipment that can be used for accurate placement of die packages. This die attacher uses a vision system and actuator for precise placement of the die packages and also has safety features for safe operation. This die attacher is reliable, efficient and provides repeatability for accurate production of die packages.