Used ASM A600 UHV-CP #9249519 for sale

ASM A600 UHV-CP is a high-quality, reliable diffusion furnace equipment designed for diverse applications in semiconductor manufacturing. The system employs a PECVD type process for in-situ oxidation and nitridation of wafers and other substrates. The unit features a high-vacuum process chamber with dual electrostatic multi-pocket effusion cells, a high current plasma source and an automated, fully configurable process control hardware/software package. The machine was developed specifically for uniformity and reproducibility of wafer thermal oxidation and nitridation process. The tool is capable of producing a broad spectrum of quality films and excellent have excellent step coverage resulting in repeatable, accurate and controlled products. The asset also features a high quality heating model, an ultra-high vacuum configuration of 10-8Torr base pressure, a wide range of process pressure range from 10E-7 to 10E-3Torr. The high quality of the equipment allows for the precise control of wafer oxidation and nitridation properties like wafer surface temperature, concentration and stability, process time and uniformity. The system is equipped with a multi-pocket, dual electrostatic effusion cell, an automated process controller, a temperature process controller, a high current plasma source and other accessories, such as a cryo-fingertip, a clamp and a gas panel, for convenience in performing a various process experiments. The unit includes a high-velocity exhaust fan for fast evacuation of gaseous and particulate waste created during processing operations. The machine also includes a number of safety features to ensure the safety of the tool during operation, such as an isolation switch (slotted in series) for protection against voltage fluctuations. The asset is also designed to facilitate flexibility in its usage, as it can be used for a variety of process demands, such as thermal oxidation, nitridation and silicidation processes. The model can accommodate a wide range of wafer sizes (5-12 inch) for efficient and uniform thermal oxidation and nitridation of silicon wafers and other substrates. A600 UHV-CP equipment is ideally suited for a variety of process applications such as semiconductor wafer oxidation, nitridation, silicidation and other high-quality electronic and optoelectronic components manufacturing. This high-quality system with its exceptional reliability and compatibility is a firm favourite among professional users.