Used ASM MIR 3000 #9235122 for sale

ASM MIR 3000 diffusion furnace and its associated accessories offer a reliable and efficient method of forming and integrating microscopic layers of materials on the surface of semiconductor wafers. MIR 3000 systems uses diffusion processes to create various structures and components on wafers, such as gate oxide layers, interconnect vias, and epitaxial layers. These parts form the building blocks for an entire semiconductor device or equipment. In addition to diffusion, ASM MIR 3000 system offers ion implantation capabilities, allowing the creation of dopant regions and layers in order to control the conductivity of the semiconductor unit. MIR 3000 machine features a core furnace designed for optimal diffusion performance and process repeatability utilizing rapid thermal transients and tight control of the chamber environment. The furnace has a specialized six-zone chamber design that offers precise temperature control of each of the process zones, while also providing a low induced-etching environment that allows for the fabrication of fine device feature sizes. The dual-chamber configuration of the furnace provides an additional option for batch-style anneal processes. ASM MIR 3000 tool is also capable of fabricating high quality epitaxial and other oxide layers, as well as thin-film dielectrics and contact metal stacking layers. These layers are typically used as insulating layers, gate oxides, and transistors. The asset has a load-lock model to ensure repeatable starting and ending points for each process, as well as a rapid heating and cooling gate valve for rapid purge and isolation of the chamber between runs. MIR 3000 equipment is outfitted for optimal performance; the furnace is augmented by the addition of an electronic control system, a dedicated cooling unit, and a monitoring subsystem. The electronic control machine allows for precision control over the entire process cycle. The dedicated cooling tool is used to stabilize the surface temperature, preventing unnecessary heat transfer between the wafer and the substrate within the chamber. The monitoring asset provides live feedback for temperature movement and allows for online adjustment of process parameters. ASM MIR 3000 model is an extremely reliable and efficient way to form, integrate, and fabricate layers of material on the surface of semiconductor wafers, allowing for the creation of specialized elements for a variety of electronic devices. With its ability to process layers and components quickly and accurately, this equipment is a great choice for semiconductor device fabrication.