Used DIFF IFB-ZCL03A #9292370 for sale

DIFF IFB-ZCL03A
ID: 9292370
Furnaces Interface board D4EX40194 Electric source: DC 24V / DC 5V.
DIFF IFB-ZCL03A is a precision electrical furnace especially designed for high accuracy diffusion annealing of semiconductor wafers. The furnace uses a unique coil design with carefully designed segments for maximum effective temperature uniformity. The coil is enclosed in a hermetically sealed stainless steel chamber lined with ceramic insulation and equipped with electronic air valve to control the flow of inert atmosphere in the chamber. The ultra-high purity atmosphere is maintained for the entire duration of the process through complete de-gassing. This guarantees a stable and clean diffusion atmosphere, essential for high quality results during the diffusion process. The furnace is kept at a steady and controlled temperature rate for optimal annealing results. The temperature is maintained within +-2°C, and can be set as low as 10°C to an upper limit of 1250°C with an accuracy of +-1°C. The zone temperature is maintained with PID control and the unit is equipped with a safety system, featuring emergency stop and temperature symmetric sensors. Its temperature profile is user programmable and its heat up rate can reach up to 2800°C/min, depending on the furnace model. IFB-ZCL03A has a vacuum level of +/-3 Pa and a high vacuum of +/-1 Pa, for excellent cooling capabilities. It is equipped with a gas diffusion system, featuring a turbo molecular pump and differential pressure control systems. It can also be connected to an external gas supply line. The internal diameter of the furnace is 138mm and its maximum baking length is 100mm with a residual vacuum of 2.5×10-3 Pa. The furnace's robust design is corrosion resistant and offers excellent performance and reliability. It comes with protective coatings and materials certified for insulation and up to 1,000 ppm (parts per million) ROHS compliance. This ensures maximum safety, as well as a stable thermal environment, even at high temperatures. It is also designed to be used in a range of environments, such as clean rooms and laboratory settings, and can be used with standard protection equipment. DIFF IFB-ZCL03A is an excellent choice for diffusion annealing of semiconductor wafers. Its robust design, precise temperature control, and excellent vacuum capabilities make it an ideal option for both commercial and research applications. This energy-efficient, reliable furnace can provide users with excellent results, ensuring the highest production yield and repeatability.
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