Used GT SOLAR 1001057 #9236062 for sale

ID: 9236062
Vintage: 2008
Multicrystalline furnace Capacity: 650 kg 2008 vintage.
GT SOLAR 1001057 is a diffusion furnace and accessories package that is used for crystal thinning, pre-cleaving, and silicon wafer slicing as part of semiconductor processing. The equipment is suitable for relatively small runs of silicon wafers or other materials, making it an ideal choice for research or custom projects. The furnace comes with an integrated chamber design, enabling it to quickly heat and cool materials for crystal thinning and pre-cleaving operations. It is equipped with quartz optics to enable controlled light transmission for accurate optical inspection. The system also comes with a unique bell jar design, allowing for rapid atmosphere exchange for pre-cleave operations. Additionally, the user-friendly design ensures precise control of all aspects of the operation, ensuring consistency of product quality. 1001057 package comes with a digital readout display, which presents user-friendly data presented in readouts such as wafer size, wafer size for pre-cleave operations, and more. The package also includes a number of accessories, such as an adjustable wafer slicing guide, a jig for positioning the wafer on the slicing table, and a vacuum chuck for wafer transfer. These accessories make it easy to perform crystal thinning, pre-cleaving, and wafer slicing operations with high precision. In terms of safety and reliability, GT SOLAR 1001057 meets stringent safety requirements, including CE, EN 1802/8356, and UL approval. The unit also includes self-diagnostic functions to detect any potential malfunction and protect both the machine and the wafer from any potential harm. Furthermore, the tool includes several advanced features that ensure safety and reliability, such as precise temperature control and an auto-shut off feature in case of an emergency. Overall, 1001057 asset is an ideal choice for those who need a reliable and safe model to perform crystal thinning, pre-cleave operations, and wafer slicing. Its integrated design ensures quick and accurate results, while its advanced features provide enhanced safety and reliability. Additionally, the package comes with several accessories, making it easy to perform intricate operations without any issues.
There are no reviews yet