Used KOKUSAI DJ-815V #179734 for sale

KOKUSAI DJ-815V is a high-temperature, diffusion furnace and accessories for wafer-scale electronic device pre-processing manufacturing. It is suitable for a wide range of pre-processing steps including oxidation, diffusion, and drive-in. The furnace accommodates up to 8 loaded wafers at a time, and can provide uniform temperature distribution in the entire process area. It offers a large chamber that is capable of sustaining temperatures up to approximately 1500°C during the processing. The atmospheric pressure in the process chamber can range from atmospheric pressure to enhanced pressures up to 0.93MP. DJ-815V can be integrated with a variety of accessories, including degassers, gas manifold, gas mixers, custom fabricated accessories to match specific user requirements, and a small RF generator to support plasma-based insulation processes. It is equipped with a robust, forced convection mechanism and efficient heating elements in order to ensure high temperature accuracy and uniformity. The unit is also designed with an integrated gas panel and equipped with efficient safety system and an independent over temperature protection device. The dimensions of KOKUSAI DJ-815V are 480mm (width) x 575mm (depth) x 1150mm (height), with the chamber dimension being 350mm (width) x 450mm (depth) x 750mm (height). It is capable of producing 1.2kW of low leakage power, and the temperature distribution throughout the working chamber is facilitated by three independently controllable heating elements. Further, it is equipped with a multi-segmented thermal cycle program, allowing users to configure different temperatures and dwell times for different steps of their pre-processing batch. DJ-815V is a reliable, versatile and efficient diffusion furnace ideal for chip manufacturers and related companies who require a high-temperature diffusion furnace with multiple capabilities and safe process control. Its robust construction and comprehensive range of features make it a great option for any process involving the complex integration and pre-processing of a large number of devices.