Used KOKUSAI DJ-835V #9309559 for sale
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KOKUSAI DJ-835V is a diffusion furnace equipment designed for both production and research & development applications. This high-performance system is designed to meet the needs of many industry-leading semiconductor device producers. This unit is composed of different components, including the diffusion furnace and accessories, for both uniform and precise thermal processes. The diffusion furnace provides a maximum temperature of 1200°C and a 4-zone temperature control design to ensure precise uniformity of thermal characteristics throughout the entire process. The wide adjustment range includes high temperature thermal diffusion, high temperature annealing, and rapid thermal annealing (RTA). The user can select different heating rates from 50°C to 1000°C per minute. The precisely controlled temperature is then maintained with an accuracy of ±2°C. KOKUSAI DJ 835V is equipped with a massive 6,000 through 5,000W heating capacity. Different hot zone atmosphere control systems are built into the unit to provide controlled environment for different types of device fabrication processes. These include nitrogen, forming gas, dry oxygen, and hydrogen. The cooling machine is built with a highly efficient heat-exchange unit to provide fast and reliable cooling of the wafers during fabrication. Other tool components include high temperature, water-cooled electro-magnetic shields, high-temperature water-cooled exhaust systems. The furnace has also been designed to minimize contamination by utilizing a high-efficiency gas injection asset that prevents particles, droplets, and organic residue from reaching the heated chamber. The model provides high-efficiency data acquisition for both process monitoring and control. This includes a control equipment that contains Ethernet communication interfaces. A user-friendly GUI allows the user to monitor the process parameters with ease and accuracy. The system is also combined with an advanced robotic dispense unit that is equipped with an automatic wafer alignment feature and a nozzle vacuum machine to ensure accurate wafer placement. DJ-835V tool is designed to provide reliable thermal processes with reliable and uniform results.
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