Used KOKUSAI Quixace II CURE #9351283 for sale

KOKUSAI Quixace II CURE
ID: 9351283
Wafer Size: 12"
Vertical furnace, 12".
KOKUSAI Quixace II CURE is a state-of-the-art diffusion furnace and accessory kit ideal for applications in semiconductor device manufacturing and nanotechnology research and development. It is designed for batch-plate loading and indexing to ease the loading and unloading of workpieces. Hosting a variety of high-performance features, Quixace II CURE is capable of achieving an extremely precise temperature uniformity throughout the entire chamber, enabling optimal precision processing such as thermal oxidation and silicon dioxide deposition. KOKUSAI Quixace II CURE is designed with a modular work chamber that can accept multiple-size cassettes for enhanced production throughput. The interior chamber is constructed of modular graphite heaters to ensure uniform heating of the chamber. The temperate is monitored by a digital readout, allowing for automated operations and intricate setting controls with the attached controller. The equipment also has on-board gas exhaust to manage both back pressure and process atmosphere build-up. Comprehensive safety features are incorporated as well, including pressure monitoring, over-temperature protection, and alarm interlocking for rapid emergency shutdown of the system. Quixace II CURE features a single-sided Ashing Chamber as an accessory option with a silica-titanium-coated quartz plate for easy cleaning and removal of residues. The Ashing Chamber is pressurized to protect both the chamber and the workpiece from the ashing process, and it is designed to maximize uniformity and prevent distortion. It is an efficient gas ampoule-loading unit, and the components are designed to minimize points of contact and reduce manually moving subsystem components. KOKUSAI Quixace II CURE is an ideal choice when precision processing and uniform heating are required. It is highly beneficial for creating complex structures for nanotechnology R&D, as well as semiconductor device fabrication. It is an extremely precise machine, and its temperature uniformity and safety features make it a prime choice for any application needing precision thermal processes.
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