Used KOKUSAI Quixace II #9219515 for sale

KOKUSAI Quixace II is a diffusion furnace and accessory designed to provide high-precision heat treatment and wafer fabrication services to the semiconductor industry. KOKUSAI QUIXACE-II offers superior thermal uniformity and repeatability, while managing thermal load with minimum impact on product quality. The advanced equipment features a self-contained, high-speed, multi-zone oven, capable of accommodating 8 to 16 wafers at any one time. A two-axis, autocalibrated susceptor is used to ensure uniform and repeatable heating in each of the oven's zones. In addition, the system features advanced temperature control, monitoring, and recording capabilities. Quixace II offers portfolio features required for advanced applications such as Nitride diffusion and Polysilicon deposition. With its superior temperature uniformity (±2°C) and repeatability (±1°C), QUIXACE-II provides reliable processing of advanced materials. This is achieved through the oven's patented high wafer-loading design, which ensures uniform diffusion up to 1 micron thick layers, and its robust controller, which features real-time thermal feedback and closed-loop adjustments for precise and repeatable results. KOKUSAI Quixace II also offers unparalleled process flexibility. The oven can be used for single-layer, multiple-layer, or dual-layer diffusion processing. Furthermore, the unit can be configured to support a wide range of exothermic, endothermic, and isolation processes, offering the user the ability to customize their process to meet their needs. KOKUSAI QUIXACE-II is also equipped with manual in-situ atomic force microscopy (AFM) capabilities, enabling the user to perform high-resolution measurements of wafer surfaces. This helps optimize the thermal processing, and facilitates dynamic process control for optimum results. Additionally, the machine offers access to detailed process data, allowing users to better assess the quality of their components and their end products. Quixace II is the ideal tool for achieving high-precision and cost-effective thermal processing of a variety of semiconductor components. By leveraging its advanced temperature control, monitoring, and recording capabilities, users can achieve greater process reliability and unsurpassed quality assurance.