Used POLYFLOW EP-C05 #9014479 for sale

POLYFLOW EP-C05 is a diffusion furnace and accessories manufactured by POLYFLOW Corporation. It is designed specifically for semiconductor chip fabrication. The diffusion furnace is equipped with a high-pressure hot zone capable of temperatures up to 1400°C (2550°F). This makes it ideal for high aspect ratio (HAR) applications such as Well Doping, Effective Channel Stops, Vertical Well Profiles, Waffle Structure Formation and Selective Emitter Profiles. This equipment allows for precise temperature and time control of the doping processes, resulting in superior quality chips with less stress-induced defects. The hot zone is sealed and cooled by a water-cooled wall and a high-pressure ammonia loop that enables rapid quenching and prevents contamination from atmospheric contamination. The furnace also features an oxygen-free environment for increased purity, uniformity and yield. A patented oxygen-flow sensor system provides real-time feedback of process parameters and helps eliminate post-process metallization defects. In addition to the diffusion furnace, EP-C05 also includes a variety of accessories. The first is an RTP module, which consists of multiple quenchmant heads with automated cycle control capabilities. This ensures uniform heating and cooling rates and precise temperature control allowing for more accurate and reliable wafer doping. The second is an advanced height control mechanism, which keeps the substrate at a precise, and adjustable, distance from the wafer , allowing for precise uniformity of subsequent process steps. Other accessories include an integrated web-camera unit for real-time process monitoring, individual tool partitioning to improve drift control and reduce wafer-to-wafer variation, and a variety of wafer adapters for efficient runs. Additionally, the machine utilizes a stable, low-emissivity quartz for superior thermal stability during diffusion processes. Combined, these features and accessories make POLYFLOW EP-C05 the ideal diffusion furnace for any chip fabrication application.