Used SVG / THERMCO / AVIZA RVP 9000 #293804381 for sale
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ID: 293804381
Wafer Size: 8"
Vintage: 2001
Vertical LPCVD Furnace, 8"
Main frame
AC Transformer rack
Cable
Heater
Top core assy
Miscellaneous parts
MKS 600 Series TV Controller
MKS 628F 2 Torr C/M
Smoke detector
UPS
Cables
Gas panel (FC-7800CU):
Line / Gas / Flow rate
1 / N2 / 5 SLM
2 / He / 500 SCCM
3 / He / 500 SCCM
4 / BCL3 / He / 100 SCCM
5 / Multi / 4 -1000 SCCM
6 / GEH / 4 - 200 SCCM
7 / SiH / 4 - 200 SCCM
8 / SiH / 4 - 200 SCCM
9 / N2 / 2 SLM
10 / GEH / 4 - 200 SCCM 2 SLM
PC: EPROM
2001 vintage.
SVG / THERMCO / AVIZA RVP-9000 is a highly advanced diffusion furnace equipment designed for the precise and reliable thermal processing of semiconductor wafers in the production of integrated circuits. This cutting-edge system is equipped with state-of-the-art technologies and features that enable efficient and uniform diffusion processes, making it an essential tool for semiconductor manufacturing facilities. At the core of SVG RVP-9000 is its high-temperature furnace chamber, which is capable of reaching temperatures up to 1200 degrees Celsius with exceptional temperature uniformity across the wafer surface. This stable and uniform heating profile is crucial for ensuring consistent and reproducible diffusion processes, where dopant atoms are introduced into the semiconductor material to modify its electrical properties. The diffusion furnace is equipped with a sophisticated gas delivery unit that enables precise control over the atmosphere inside the chamber during the diffusion process. This machine allows for the introduction of dopant gases, such as boron, phosphorus, or arsenic, at extremely low flow rates with high accuracy. The precise control over gas flow and mixing ratios ensures that the dopants are accurately incorporated into the semiconductor material, leading to reliable and high-performance devices. AVIZA RVP-9000 features a vertical tube design, which offers several advantages over horizontal furnaces, including enhanced gas flow dynamics and reduced wafer contamination. The vertical orientation of the wafer allows for improved gas circulation around the wafer, ensuring uniform dopant distribution and minimizing the risk of edge effects during diffusion processes. In addition to its core diffusion furnace capabilities, RVP-9000 is equipped with a range of accessories and advanced features that further enhance its performance and usability. These include a high-precision quartz tube for wafer containment, a multi-zone temperature control tool for fine-tuning thermal profiles, and an advanced gas flow control asset for precise dopant introduction. The model is also equipped with a comprehensive process control and monitoring equipment that allows semiconductor manufacturers to set and optimize diffusion recipes, monitor key process parameters in real-time, and ensure consistent process performance. The data logging and analysis capabilities of the system enable detailed process traceability and facilitate process optimization for maximum yield and device performance. Overall, THERMCO RVP-9000 is a cutting-edge diffusion furnace unit that combines advanced technologies, precision control, and reliable performance to meet the stringent requirements of modern semiconductor manufacturing. Its robust design, high-temperature capabilities, and sophisticated features make it an indispensable tool for achieving precise and uniform dopant diffusion processes essential for the production of high-performance integrated circuits.
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