Used TEL / TOKYO ELECTRON A303i #9271015 for sale

TEL / TOKYO ELECTRON A303i is a diffusion furnace and associated equipment that is designed for silicon wafer thermal processing. This advanced system features heated walls, quartz furnaces, as well as the ability to accommodate doping of a variety of materials such as polysilicon, aluminium, phosphorus, and even germanium. The quartz furnace allows users to precisely control the temperature and pressure of a quartz-lined chamber, offering a perfect environment for predictable and controllable thermal processing. TEL A303i offers maximum temperature capability up to 1200°C (2192°F) with a uniformity as low as ±5°C within the quartz chamber. The chamber is also designed to minimise wafer damage due to heating and cooling; an innovative design features a built-in water jacket to protect the quartz from any thermal shock. TOKYO ELECTRON A 303 I allows users to precisely control temperatures, time and pressure. Pre-programmed functions, including soak time and step heating, are available to offer the user greater control over thermal processing parameters. The process controller further adds to the unit's flexibility by providing a powerful on-board computer with user-friendly software, allowing users to program processes manually or to take advantage of the pre-programmed functions. Additionally, the user can select from a wide range of process settings to customise each thermal process. Sensors installed on the chamber keep wafer temperature and pressure controlled and monitored throughout the entire thermal process. Hardware-wise, the machine consists of a Quartz Tube, a Vacuum Chamber, and a Quartz Dome, each of which are designed to be compatible with the tool's latest technologies. The asset also comes equipped with a Safety Gas Pressure Regulator to ensure that the gases used are kept within the specified limits. Additionally, a Wafer Heater Plate, a Hot Plate, and a Quartz Plate are available for an even more efficient and reliable thermal process. A 303 I is a reliable, easy-to-use diffusion furnace and accessorie model designed to give users precision control over thermal processes. It offers maximum temperature capability up to 1200°C, a uniformity as low as ±5°C, and pre-programmed functions including soak time and step heating in order to tackle a variety of thermal processing needs. This equipment is perfect for silicon wafer processing due to its built-in protection from thermal shock and its ability to precisely control temperatures, time, and pressure.