Used TEL / TOKYO ELECTRON Alpha 303i-K #9373155 for sale
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ID: 9373155
Wafer Size: 12"
Vintage: 2006
Vertical LPCVD furnace, 12"
Process: TEOS
(100) Process wafers
I/O Port / SMIF: FOUP
No load lock
25-Carrier slots
Boat type: Single
Main controller (WAVES)
Operation screen: Touch screen
Gas flow chart: Front and rear
M560 Temperature controller
Vacuum pressure control: CKD VEC
Controller transformer: 208 V, Single phase
Heater transformer: 208 V, 3 Phase
Gases:
Gas 1: N2
Gas 2: N2
Gas 3: O2
Gas 4: TEOS
Gas 5: N2
Gas distribution:
Basic style: Conventional
Tubing material: SUS-316L
Tubing finish: VCR
Manual valve: CKD
Air operated valve: CKD
MFC: HORIBA STEC
Exhaust distribution:
Air operated valve type: IGS Connect
Main valve: CKD VEC
Cold trap
No pump line
Wafer / Cassette handling:
(16) Cassette storage
Cassette In/Out port
Cassette handling robot
Wafer transfer type: 1 + 4
Fork material: AL2O3
Fork variable pitch
Fork wafer presence sensor
Elevator handling:
Boat elevator
Auto shutter
Boat rotation
Mechanical parts
Heating chamber:
Heater type: VMM-56-002, 100 wfs
(5) T/C Type
(5) Spike T/C
Furnace cabinets includes clean air flow system
Scavenger and water cooling unit
Power supply unit (U/P Box):
Control unit
Transformers
SCR
Breaker unit
FOUP and wafer handling automation:
(2) FOUP Load ports
FOUP Transfer
Stocker: (18) FOUPs
FIMS Port
KHI Wafer load automation
Variable pitch change mechanism with (5) forks
Auto tube shutter
Boat elevator with boat rotation mechanism
Integrated gas system in gas cabinet and TEOS LSC baking system:
O2 Gas line
TEOS Gas line
Purge N2
Vacuum vent
Exhaust vent
Piping tape heater
Main valve type: CKD Hot, P/N: VEC-VH8G-X0101
Vacuum gage
Pressure switch
Piping: 100 A VAC
Does not include:
Outer/Inner T/C
N2 Load lock
N2 Boat cooling shower
Dual boat operation
B.S Sensor: 0-10 Torr, 0-1000 Torr
Cable length: 12 m (Power box)
AC Power box: 208Ｖ,3 Phase, 4 Wires
2006 vintage.
TEL / TOKYO ELECTRON Alpha 303i-K is an advanced diffusion furnace and accessories equipment enabling customers to perform high-quality, low-cost, high-throughput semiconductor fabrication processing. The system features a single-zone furnace, a gas delivery unit, an on-board wafer loader, an automated wafer transfer arm and a controller. The single-zone furnace utilizes low-velocity, low-expansion quartz tubes to meet component diffusion requirements and provide improved thermal uniformity and wafer temperature stability. With a maximum working temperature of 1,100°C (2,012°F), TEL ALPHA 303IK is well suited for dielectric and metallization layers and related processes. Additionally, the machine features an innovative protective atmosphere gas stagnation tool, which helps ensure consistent flow and response, allowing for optimal performance with a wide range of gases. The on-board wafer loader provides an efficient and automated way to feed wafers into the asset quickly and reliably. With its large capacity and multiple load options, TOKYO ELECTRON ALPHA 303 I K is well equipped to handle a variety of wafer sizes and substrates. Combined with the automated wafer transfer arm, ALPHA 303IK eliminates the need for manual wafer handling and improves throughput times. The model is easy to operate and maintain, featuring a controller with intuitively designed menus and windows for enhanced usability. The controller offers control parameters such as ramp and soak settings, furnace operation parameters and gas delivery settings. Additionally, the controller can be interfaced with an external PC to allow for the remote monitoring and evaluation of process data, ensuring process performance and reliability. TOKYO ELECTRON Alpha 303i-K is the ultimate solution for customers requiring an efficient and cost effective diffusion furnace and accessories equipment. The system features a single-zone furnace, an automated wafer transfer arm, an on-board wafer loader, a protective atmosphere gas stagnation unit, and an intuitive controller. Fully automated, user-friendly and with reliable performance, TEL ALPHA 303 I K is the ideal choice for demanding semiconductor fabrication processes.
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