Used TEL / TOKYO ELECTRON Alpha 303i-K #9394535 for sale

TEL / TOKYO ELECTRON Alpha 303i-K
ID: 9394535
Wafer Size: 12"
Furnace, 12" Gases: SiH4, Si2H6, H2, ClF3, LTO520 (Liquid).
TEL / TOKYO ELECTRON Alpha 303i-K is a single-frame, large-scale, general-purpose processing equipment used in semiconductor fabrication industry. This system has two components, a diffusion furnace and ancillary equipment. TEL ALPHA 303IK diffusion furnace offers many advantages, such as improved uniformity and fast run times. The furnace itself has a high thermal uniformity of approximately ±1°C over a wide area of the wafer, and can reach a temperature of 1150°C in approximately 20 minutes. The furnace also has two independent zones designed for two different types of process capability. The float zone can process up to 1,200°C, and the graphite zone can reach temperatures up to 1,700°C. Furthermore, the furnace is designed with a U-shaped quartz tube, providing uniform heating and cooling to assure a high-quality film deposition. The unit also features ancillary equipment that enhances the processing capabilities of the furnace. This includes a computer-controlled wafer loader/unloader, four sets of non-contact vacuum on/off capacitance gauges, three types of hot chuck options, an independent pre-heat station, and a gas feed machine. The wafer loader/unloader allows wafers to be loaded and unloaded automatically with precision control. The non-contact gauges provide precise measurement of the wafer temperature, while the hot chuck options enhance the thermal uniformity across the wafer. The independent pre-heat station provides a fast preheating time with high wafer temperature uniformity, while the gas feed tool supplies a variety of process gases for the reliable deposition of films. Overall, TOKYO ELECTRON ALPHA 303 I K is an excellent diffusion furnace asset that provides robust performance with reliable results. Its wide range of processing capabilities make it an ideal choice for a variety of processes. The computer-controlled wafer loader/unloader, independent pre-heat station, and non-contact vacuum on/off capacitance gauges add to the efficiency and accuracy of the model. The furnace, with its high thermal uniformity of ±1°C over a wide area, ensures production of high-quality films with short run times.
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