Used TEL / TOKYO ELECTRON Alpha 8S-Z #293794329 for sale

TEL / TOKYO ELECTRON Alpha 8S-Z is a 300mm plasma etch and deposition diffusion furnace that is manufactured by TEL, a leading provider of semiconductor capital equipment. It provides uniform distribution of temperatures and is designed to nanometer scale precision requirements. This equipment is designed specifically to meet the needs of customers developing advanced thin film structures and components. TEL ALPHA 8SZ features an advanced high-vacuum environment allowing ultra-precise thin film processing and nanometer scale precision. The temperature uniformity provides uniform process conditions as well as a stable source of temperature in the process zone. The equipment has an automatic thermal control system that monitors both the individual processes along with the overall performance of the equipment. This unit allows for full automation of the processing needs and ensures quality of the results. The diffusion furnace is equipped with multiple power supply options, including pulsed magnetron sputtering, electron cyclotron resonance sputter ion plating, and radio frequency plasma sputter deposition. It is also capable of independent power regulation for each power supply. The compact design of TOKYO ELECTRON ALPHA 8 S-Z allows for flexibility and portability and includes multiple safety systems for maximum safety. The machine includes a range of support accessories, such as target holders, sample holders, flood shields, wafer holders and cooling exhaust pipes, to increase productivity and reduce downtime. The selection of accessories allows for maximum flexibility to customize the tool according to application requirements. Finally, TOKYO ELECTRON Alpha 8S-Z features an optional sample analysis asset (QMS-6000 series) to analyze the sample results and optimize the model performance. In summary, TEL Alpha 8S-Z is a highly advanced diffusion furnace and accessories that provide nanometer precision processing in a high-vacuum environment. It includes a range of power options, accessories for increased flexibility and an optional sample analysis equipment. This system greatly simplifies the development of advanced thin film structures and components.