Used TEL / TOKYO ELECTRON IW-6C #9280805 for sale

TEL / TOKYO ELECTRON IW-6C is a state-of-the-art diffusion furnace used for the deposition of metal films on substrates. This product is used for a wide range of applications, from surface modification to film deposition in various industries. TEL IW-6C is equipped with a process chamber which is designed with a particular focus on providing excellent uniformity of temperature and gas flow within the chamber. This makes it perfect for depositing uniform metal films over the substrate. TOKYO ELECTRON IW 6C is equipped with both Low Pressure Chemical Vapor Deposition (LPCVD) and High Pressure Chemical Vapor Deposition (HPCVD) technologies. This allows the user to perform an array of processes, making it ideal for a wide range of applications. To further enhance the uniformity of film deposition, IW 6C has a high precision Flow Control Valve. This valve is used for controlling the process gas flows to ensure a uniform flow rate, which is essential for film deposition. The incorporated flow valve is also useful as it ensures the accurate concentration of gas and prevents deposition of impurities which can cause defects in the film. TEL / TOKYO ELECTRON IW 6C also has a highly efficient mechanical pump which helps improve throughput. This pump can efficiently and quickly remove residual gases from the process chamber. This process ensures that the deposition process occurs uniformly and improves the lifetime of the raw materials. TOKYO ELECTRON IW-6C comes with multiple accessories that enhance its performance and functionality. These accessories include an automated heater control system and an automated safety shutter for protecting the user from direct radiation. Additionally, IW-6C also includes an advanced software package which facilitates full parameter control and can be used for automated data logging and analysis. TEL IW 6C is ideally suited for the reliable deposition of thin films of metal and other materials onto substrate surfaces. This product is perfect for a wide array of applications and provides excellent uniformity of temperature, gas flow, and film deposition which makes it ideal for a variety of processes.