Used ESEC / OERLIKON Equipment for sale

ESEC/Oerlikon is a leading global manufacturer specializing in electronics bonding and packaging solutions. With a rich history dating back over half a century, the company has been at the forefront of technological innovation, providing cutting-edge bonding equipment and materials to various industries. Originally founded in Switzerland in 1959, ESEC was known for its expertise in semiconductor backend processes. Over the years, the company expanded its product portfolio and global presence, ultimately becoming part of the Oerlikon Group in 1998. The merger created a powerhouse in the field of electronics manufacturing. One of the key products offered by ESEC/Oerlikon is the advanced bonder technology. These precision machines are used for the assembly and packaging of semiconductor devices, enabling high performance and reliability. The bonders are equipped with advanced features like automated handling systems, precision optics, and control software, ensuring accurate and efficient bonding processes. In addition to bonders, ESEC/Oerlikon provides various other solutions for semiconductor backend processes. This includes die attach equipment, wire bonders, mold and trim machines, as well as inspection and test systems. These products cater to the needs of diverse industries like automotive, aerospace, telecommunications, and consumer electronics. ESEC/Oerlikon's commitment to innovation and customer satisfaction has positioned them as a trusted partner for Electronics Manufacturing Services (EMS) providers, semiconductor manufacturers, and electronic design houses. Their products deliver excellent quality and performance, enabling customers to stay ahead in a rapidly evolving market. With a global network of sales and service centers, ESEC/Oerlikon ensures quick response times and comprehensive support, establishing themselves as a reliable and technically superior solution provider in the electronics industry.