Used AMAT / APPLIED MATERIALS 8116 #9226745 for sale
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ID: 9226745
Wafer Size: 6"
Vintage: 1992
Oxide etcher, 6"
Missing parts
1992 vintage.
AMAT / APPLIED MATERIALS 8116 is a plasma etch and asher system designed for medium-to-high volume production. It is capable of handling the etching and ashing needs of several industries, including semiconductor, microelectronic, and MEMS applications. AMAT 8116 plasma etch and asher system features advanced plasma etch technology and integrated top-down wafer cleaning, making it a reliable and efficient plasma etch and asher choice for cleanroom environments. APPLIED MATERIALS 8116 features individual vacuum chambers that are each capable of processing up to 8 wafers at a time. Each chamber has its own controller and vacuum source, enabling independent etching of each wafer. This allows etch and asher systems to handle multiple batches at once with different etch parameters, resulting in improved throughput and productivity. 8116 features the use of RF power for plasma generation, as well as a two-plasma source to prevent internal reflections that can be caused by single source designs. It is capable of etching in multiple gases and can produce a wide range of etch rates and selectivities. The flexibility of AMAT / APPLIED MATERIALS 8116 allows it to be used in a variety of critical industrial applications, including materials processing, wafer-level packaging, and advanced manufacturing processes. AMAT 8116 also features a bottom-up wafer loading mechanism and dynamic chamber pressure that enables precise control of etch processes. This allows it to be used in producing delicate structures such as silicon oxide and nitride films, and for etching high aspect ratio trenches. Its ability to perform etch processes across multiple wafers makes it an important tool for semiconductor production. In addition, APPLIED MATERIALS 8116 includes a unique in-situ wafer cleaning process that uses an etching gas to clean the chamber after each cycle. This feature keeps the chamber clean and prevents gases from being re-circulated during etch processes. This reduces the risk of contamination and ensures that etch processes are consistent across multiple wafers. This adds to the overall quality and reliability of the etch process. Overall, 8116 is a powerful and reliable etch and asher system designed for medium-to-high volume production. It is capable of simultaneously handling up to 8 wafers and employs advanced technology to ensure consistent etch processes and cleanliness of the chamber. Its flexibility and in-situ wafer cleaning features make it an essential tool in the semiconductor industry and many other industries.
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