Used AMAT / APPLIED MATERIALS 8310 #293619542 for sale

AMAT / APPLIED MATERIALS 8310 Etcher/Asher is a tool used in semiconductor fabrication that is designed to provide a precise and chemically controlled etching process. The equipment enables chemical etching with precise control over the chemical reaction parameters and etch chemistry. It is used to etch or shape a wide variety of materials including metallic surfaces, silica (silicon oxide), nitrides, and polymers. AMAT 8310 consists of a fixed-speed turntable, a chamber that houses the etch chemical, and a gas feed sub-system. The turntable is designed to accurately spin the substrate at a reliable speed in order to evenly apply the etch chemistry. The etch chamber contains a series of teflon-coated electrodes, each of which delivers a controlled amount of etch pharmaceutical. The gas-feed sub-unit delivers a series of gases, such as CF4, O2, and N2, to the chamber and provides the optimal environment for the chemical etching process. The process is initiated by loading substrates into the high-vacuum chamber within the machine. The mechanical spinning of the turntable is controlled by an adjustable speed motor and the etch chemistry is provided by an automated chemical delivery tool. The gas feed sub-asset will then introduce the appropriate gases needed to support the etch process and the electrodes within the chamber will create an even distribution of the etch chemical. The chamber is then pressurized and brought to the necessary temperature and pressure for the etching to take place. The process is then monitored by an RF generator and monitoring model. This equipment controls the amount of radio frequency power being applied to the wafer, ensuring the etching happens at the correct rate. The monitor also displays process parameter information that shows the degree of etching achieved, the time remaining before the etch is complete, and the current operating temperature and pressure of the chamber. Once the etching is complete, the chamber is vented, depressurized, and cooled. The substrate is then removed from the chamber and inspected with an optical microscope to verify the desired pattern and surface topography. APPLIED MATERIALS 8310 is capable of processing thousands of substrates without manual intervention, ensuring fast and reliable etching.