Used AMAT / APPLIED MATERIALS 8330 #9076176 for sale

AMAT / APPLIED MATERIALS 8330 Etch/Asher is a compact, cost-effective and high-yield machine designed for etching and ashing of multiple layers in semiconductor applications. It is a dual-chamber system consisting of an etching chamber and an ashing chamber, allowing users to perform etching and ashing operations in a single machine. AMAT 8330 is engineered to maximize throughput of high-volume productions and can process up to 150 wafers per hour. The etcher/asher utilizes advanced, precise RF plasma technology to ionize process gases to create a volumetric RF plasma that is distributed evenly across the wafer surface. This uniform, consistent, and tuneable process gas waveform allows for precise etching rates and excellent process uniformity. APPLIED MATERIALS 8330 consolidates etch and ashing operations into one machine, eliminating the need for separate etching and ashing equipment and providing a single-source solution for high-volume wafer fabrication operations. 8330 features advanced programming, process monitoring, and system maintenance capabilities. Its advanced HMI (Human Machine Interface) allows users to easily configure, monitor, and control process parameters through touchscreen or mouse/keyboard. Additionally, the machine includes multiple modes and functions that enable users to program, store, and monitor hundreds of recipes for sophisticated production operations. The advanced process monitoring capabilities provide real-time monitoring of process conditions, allowing for precise process control, and allowing users to easily troubleshoot and adjust parameters to optimize performance. The Etch/Asher includes capacity for up to eight process gases, and boasts a maximum pressure capability of 350 mTorr. The system is equipped with an active-clamping 6'' wafer loadlock, helping to ensure process repeatability, substrate-to-substrate uniformity, and excellent yield. AMAT / APPLIED MATERIALS 8330 is designed for versatile, high-volume production capabilities, and is ideal for a wide range of process steps including dry etch, semiconductor device fabrication, dielectric processing, and wafer bonding. It is an extremely efficient machine, with a compact design that takes up minimal floor space, and its low maintenance requirements and user-friendly interface make it an ideal choice for many production operations.