Used AMAT / APPLIED MATERIALS 8330 #9365711 for sale

AMAT / APPLIED MATERIALS 8330 is an advanced etcher and asher specifically designed for the most challenging etching and ashing requirements. It uses reactive ions to achieve precise etching and ashing on substrates such as silicon wafers, MEMS, imaging, and displays. AMAT 8330 has a proprietary process set-point optimization (PSO) capability, which enables better control of the etching process parameters, such as profile uniformity, repeatability, reproducibility, edge curvature, and reproducibility. To ensure uniformity and stability during the etching process, APPLIED MATERIALS 8330 is equipped with a series of automated temperature control mechanisms. 8330 has a throughput of up to 200 wafers per hour, depending on the process requirements. It is also equipped with a non-reactive chamber, which has excellent performance for high precision, high density, and high selectivity etching process. AMAT / APPLIED MATERIALS 8330 also offers a user-friendly Graphic User Interface (GUI) with embedded up-level recipes to help maximize process conditions and accelerate throughputs. AMAT 8330 is also capable of handling substrates with different thicknesses, including thin layers such as polyimides. It is also equipped with a nitrogen purge equipment for improved O2-free processing to ensure consistent results, even when processing substrates with the same layer stack. APPLIED MATERIALS 8330 offers a complete automated wafer handling system, as well as quick-lock chuck technology for substrates up to 8" in diameter. It also has an integrated vision unit that allows for automated wafer alignment and monitoring for increased process control. The engine is capable of handling high-pressure integration for efficient cooling and etching. It is also adaptive to chamber recipes for better process optimization in multi-step processes. 8330 etcher and asher is an effective and reliable tool for advanced etching and ashing. Its sophisticated design delivers precise, repeatable, and reproducible processing results. Additionally, its large throughput and integrated vision machine offers an optimal way to maximize the efficiency of silicon wafers and substrates with multiple layer stacks.