Used AMAT / APPLIED MATERIALS Centris #9401959 for sale

AMAT / APPLIED MATERIALS / AKT Centris is an etcher and asher equipment for processing wafers in semiconductor and MEMS manufacturing. The system provides precise and repeatable results for etching and ashing of both rigid and flexible substrates. It is designed to meet the demanding requirements of the semiconductor processing industry. The unit consists of a cryogenic etcher, a cryogenic asher, and a flex-etch chamber. The etcher is a process chamber designed for the removal of materials from wafers or substrates. The process is based on the principle of ion bombardment, which basically involves the use of energetic ions to etch or sputter away materials from the substrate, leaving behind clean and precise surfaces. The asher chamber is a cryogenically-powered, process chamber designed to ashing or removing specific layers or materials from the surface of wafers or substrates. The combination of etching and ashing provides a versatile and precise process for the fabrication of wafers for digital circuits, analog devices, and MEMS components. The flex-etch chamber is used for the precise etch removal of thin layers from the surface of flexible substrates like polyimides, polyester, and polychloroprene. It is designed to achieve the highest resolution in substrates and ensures the cleanliness of devices after the etching process. AKT Centris etcher also features a simplified interface for etching and ashing and is easily integrated with any wafer-processing toolset. This allows users to quickly and easily access etch and ashing parameters, process control, and post-process data. The machine can also be integrated with a variety of process control systems, providing the flexibility necessary to meet specific production needs. In conclusion, AMAT Centris etcher/asher is a reliable and versatile tool for processing wafers in semiconductor and MEMS manufacturing. It employs precision etch and ashing technologies that provide consistent, repeatable results for both rigid and flexible substrates. The asset is feature-rich, easy to use, and quickly integrated, making it an ideal choice for semiconductor fabrication.