Used AMAT / APPLIED MATERIALS Centura 5200 Phase II #293817415 for sale
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ID: 293817415
Wafer Size: 8"
Metal etcher, 8"
Wafer shape: SNNF
Process gases for chambers A and B: CF4, O2, CHF3, N2, SF6, Ar, HBr, Cl2, C4F8
Transfer chamber type: HP+
Heater / Pedestal type: DPS cathode ESC (chamber A, chamber B)
Lid type: DTCU with dual match (chamber A, chamber B)
RF generator / matching network: Apex 5513 + MKS GHW12A (chamber A, chamber B)
Chamber type / Location / Process
Position A / DPS-DTM / Metal etch
Position B / DPS-DTM / Metal etch
Load Lock A and Load Lock B: Wide Body, platform, wafer slide detect
(3) P/N: 0190-32036 Thermal сhiller
P/N: 0190-53161 SMC Chiller
EBARA System pump
EBARA Load lock pump
SBC upgraded to Vita сontroller.
AMAT / APPLIED MATERIALS Centura 5200 Phase II is a dry-etching/ashing equipment designed for deep silicon etching/ashing and photomask repair. The system provides excellent etch/ash uniformity and enables very high selectivities between different materials. AMAT Centura 5200 Phase II can process wafers up to 8" in diameter with an etching/ashing time up to 10 minutes. APPLIED MATERIALS Centura 5200 Phase II is a single wafer processor designed to provide high-precision etching and ashing of various on-wafer materials. The unit includes a showerhead RF (Radio Frequency) source, gas delivery machine, RF generator, digital MFC (mass flow controller), and exclusive Ultra-Shear gas entraining process. The hot inert gas is mixed with process gases to increase etching/ashing rates. The RF generator utilizes an innovative dual-frequency design which provides a broad power range and allows for optimal etching/ashing recipes. Centura 5200 Phase II offers an advanced etching/ashing module for greater precision and uniformity. The module utilizes a linear motion stage and a dual-side loadlock to transport wafers between vacuum chambers. The chamber contains a planar inductor, gas delivery tool, and RF coupling technology for direct RF power delivery to the wafers. The chamber body is equipped with robust, vibration-resistant components to ensure reliable operation for continuous etching/ashing. AMAT / APPLIED MATERIALS Centura 5200 Phase II asset provides very tight end-point control through OES (optical endpoint detection) and monitoring of the monitored parameters such as etch rate,profile depth and etching uniformity. The model also features a powerful etch process monitor which accurately calculates the etch rate every few seconds and allows higher process precision. AMAT Centura 5200 Phase II also enables advanced photomask repair capabilities, such as removal and replacement of patterned features. APPLIED MATERIALS Centura 5200 Phase II offers a modular design to allow for easy maintenance and upgrade capability. The equipment utilizes a simple graphical user interface for configuring and operating the system. Additionally, the unit has the capability to download recipes from remote locations or through a USB port. This allows for easy recipe optimization or recipe transfers to other systems. Overall, Centura 5200 Phase II is a versatile, advanced dry-etching/ashing machine offering excellent uniformity and high selectivity between different materials and an array of features that allow for optimized recipes and photomask repair.
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