Used AMAT / APPLIED MATERIALS Centura AP AdvantEdge G5 Mesa T2 Poly #9282262 for sale

AMAT / APPLIED MATERIALS Centura AP AdvantEdge G5 Mesa T2 Poly is an etcher/asher designed to precisely etch and remove material from a substrate. It is a versatile tool for etching processes in Silicon Valley and other semiconductor device manufacturing processes. It can be used to remove thin films, silicon dioxide, and a variety of other materials from wafers for device fabrication applications or for cleaning processes. The G5 Mesa T2 Poly is a fully automated dry etching tool with quick cycle time, exceptional process control and extremely low cost of operation. It offers an advanced deposition system for precise etching and ashing for a variety of materials. It comes equipped with a high-frequency generator, allowing for fast, efficient materials removal from a substrate. The system's software enables easy parameter programming to create a process suitable to any specific etching/ashing application. The G5 Mesa T2 Poly has a large wafer capacity and magnification lens for enhanced viewing and process control. It has the ability to process both standard 200mm and large-sized wafers, while providing a full range of services from patterning to contact etching. The QPCR technology (Quartz Pressure Control Raster) allows the user to control the etching process with the same tool. It is able to provide high-precision patterning for advanced devices. The asher can also be used for a variety of cleaning processes such as dry-ice cleaning, solvents cleaning, and oxygen plasma cleaning. It offers a revolutionary "intelligent" cleaning process that keeps contact residue within adhesion levels for the utmost quality of cleaning results. The G5 Mesa T2 Poly's design combines modern compatibility and multiple features, all of which can be easily modified, providing a highly precise, repeatable, and quickly repeatable results with a high-yield. It has a robust design and fast process times, as well as low consumption costs and an extreme ease of operation, making it an optimal choice for etching and ashing operations.