Used AMAT / APPLIED MATERIALS Centura AP AdvantEdge G5 Mesa T2 Poly #9282263 for sale

AMAT / APPLIED MATERIALS Centura AP AdvantEdge G5 Mesa T2 Poly is an etcher/asher equipment designed for the high-performance etching and ashing of silicon, gallium arsenide (GaAs), and other semiconductor materials. This state-of-the-art system is equipped with advanced process technology for excellent etch and ashing capabilities. This unit offers unmatched precision, accuracy, and repeatability for the etching and ashing of semiconductor materials. The machine is equipped with a Mesa Adaptive Pattern Generator (APG) which is an advanced processing technology used to precisely align and shape patterned structures on semiconductor substrates. The Mesa APG also helps eliminate the impacts of outside environment changes such as temperature as well as chemical concentration and pressure on the final product. This tool also features a Poly-Si-C® collimation lens which provides high-resolution and efficient etch and ashing capabilities, while eliminating low-temperature deposition problems that can occur in typical etching and ashing processes. For reliable, repeatable etching and ashing process control, the asset is also equipped with a Quartz Discharge Oxidation (QDO) controller, and a QDOTM process monitor. The QDO controller helps to provide stable power for etching and ashing a wide range of materials and substrates, and the QDOTM process monitor helps to measure crucial etching and ashing parameters. The model is further equipped with AMAT patented MesascanTM technology, which provides an imaging capability for real-time process data information. This feature allows operators to monitor and control etching and ashing parameters as well as remain alert for any anomalies that may occur in the process. Finally, the equipment's software is equipped with a powerful set of automated tools and diagnostic software for easy set-up, control, and verification of the etching and ashing process. Overall, AMAT Centura AP AdvantEdge G5 Mesa T2 Poly is an advanced etching and ashing system, equipped with a powerful set of features to ensure optimal performance. Its Mesa APG, Poly-Si-C collimation lens, and QDO controller provide precise, repeatable etching and ashing while its MesascanTM technology provides real-time imaging capability for detecting any anomalies in the process. Finally, its automated tools and software provide a high degree of ease for set-up and control of the etching and ashing process.