Used AMAT / APPLIED MATERIALS Centura AP DPS AdvantEdge G2 #293831242 for sale

ID: 293831242
Wafer Size: 12"
Vintage: 2014
Metal etcher, 12" N2 Load port (4) Chambers Does not include Hard Disk Drive (HDD) Gases: Chamber 1, 2 and 3: HBr, BCl3, Cl2, O2, CHF3, N2, SF6, CF4, Ar, He Chamber 4: CF4, O2, N2 Gas line # / Gas / Flow (sccm) 1 / BCl3 / 200 sccm 2 / HBr / 400 sccm 3 / Cl2 / 50 sccm 4 / Cl2 / 400 sccm 5 / O2 / 10 sccm 6 / O2 / 100 sccm 7 / He / 400 sccm 8 / N2 / 200 sccm 9 / SF6 / 200 sccm 10 / CHF3 / 50 sccm 11 / CF4 / 200 sccm 12 / Ar / 400 sccm 2014 vintage.
AMAT / APPLIED MATERIALS Centura AP DPS AdvantEdge G2 is a highly advanced plasma etcher and asher equipment utilized in semiconductor manufacturing and other industries requiring precise material removal, surface cleaning, and patterning capabilities. This cutting-edge system offers exceptional process control, high productivity, and superior uniformity, making it an indispensable tool for achieving high-performance electronics and other advanced technology applications. AMAT Centura AP DPS AdvantEdge G2 features a versatile design that allows for both dry plasma etching and plasma ashing processes, catering to a wide range of material types and applications. Its dual-mode functionality enables users to switch between etching and ashing modes seamlessly, maximizing process flexibility and efficiency. This unit is commonly used for etching various materials, such as silicon, silicon dioxide, silicon nitride, metals, and dielectrics, as well as for ashing photoresist and other organic films. At the heart of APPLIED MATERIALS Centura AP DPS AdvantEdge G2 is a sophisticated plasma generation and control machine that ensures precise and uniform processing of substrates. The tool utilizes a combination of radio frequency (RF) and microwave sources to create a plasma that interacts with the surface of the substrate, allowing for selective material removal or modification. The plasma parameters, such as gas chemistry, pressure, power, and temperature, can be precisely controlled to achieve the desired etch or ash profile with high reproducibility. The asset is equipped with advanced endpoint detection capabilities, which enable real-time monitoring of the etch or ash process and accurate determination of process endpoint. This feature is crucial for achieving consistent results and preventing over-etching or under-etching of the substrate. Additionally, Centura AP DPS AdvantEdge G2 incorporates advanced process gas flow control mechanisms, such as mass flow controllers and pressure regulators, to ensure optimal gas mixing and distribution within the process chamber. AMAT / APPLIED MATERIALS Centura AP DPS AdvantEdge G2 is designed for high throughput and productivity, featuring a dual-chamber configuration that allows for simultaneous processing of multiple substrates. This parallel processing capability not only increases model efficiency but also reduces overall manufacturing costs by maximizing wafer output. Moreover, the equipment is equipped with advanced wafer handling and robotics systems that ensure precise substrate loading/unloading and minimize cycle times for increased throughput. In terms of process uniformity and repeatability, AMAT Centura AP DPS AdvantEdge G2 excels in providing consistent results across the entire substrate surface. The system incorporates advanced temperature control mechanisms, such as heating and cooling features, to maintain a stable process environment and ensure uniform etch or ash rates across the wafer. Additionally, the unit is equipped with in-situ metrology tools, such as optical emission spectroscopy (OES) and ellipsometry, for real-time monitoring of process parameters and feedback control. Overall, APPLIED MATERIALS Centura AP DPS AdvantEdge G2 is a state-of-the-art etcher and asher machine that offers unparalleled capabilities for precision material processing in semiconductor and advanced technology industries. Its advanced features, process control capabilities, and high-throughput design make it a crucial tool for achieving high-performance device manufacturing with exceptional quality and reliability.
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