Used AMAT / APPLIED MATERIALS Centura AP DPS MESA #293625378 for sale

ID: 293625378
Wafer Size: 12'
Etcher, 12".
AMAT / APPLIED MATERIALS Centura AP DPS MESA is an etcher / asher equipment designed to perform a range of etching, deposition and surface treatment processes with both ultra-high vacuum (UHV) and low-vacuum technology. It is suitable for processes such as etching of wafers, deposition applications, liftoff processes and MEMS / MOEMS device fabrication. The system is configured for chemical etching and contains the ability to select the best available etching processes for each wafer or wafer batch. It is also equipped with a highly-stable gas delivery unit and a dedicated angular electrostatic beam source to guarantee higher accuracy. Its advanced software controls provide the capability to tightly regulate the etching processes and maintain maximum yield per each process. This allows users to customize recipes at a batch level to achieve desired results. The machine features a user-friendly graphical interface to allow for easy setup and operation of the tool. It is also equipped with several analysis and monitoring capabilities to enable real-time monitoring of etching processes. This is especially useful when optimizing etching processes in a cost- effective manner. In addition, the asset offers advanced post-processing capabilities to maximize the performance of etching processes. These post-processing capabilities include leakage test capabilities, facet scalability, and in-process etch rate/depth measurement. AMAT Centura AP DPS MESA is capable of working with multiple loading configurations and can accommodate a wide variety of substrates up to 8" in diameter. Furthermore, the model is rated for use with a variety of gases and has a wide range of field comprehensive coverage. It is also compatible with a host of safety and environmental standards, such as SEMI-S2 and F2, to ensure its safe and proper use. In conclusion, APPLIED MATERIALS Centura AP DPS MESA is an etcher/ asher equipment that is suitable for a wide range of etching, deposition and surface treatment processes. Its advanced features and capabilities make it an ideal choice for achieving desired results in an efficient and cost-effective manner.
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