Used AMAT / APPLIED MATERIALS Centura DPS II Metal #9288582 for sale
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ID: 9288582
Wafer Size: 12"
Vintage: 2006
Metal etcher, 12"
Chamber configuration:
Chamber A: DPS II Metal
Chamber C and D: ASP
Process chamber:
Process kits:
DPS II Poly parts / Chamber
Lid
ESC Power supply: 0010-14630 HV Module
Control type: TGV VAT 65050-PH52-AFS1
EOP Type: Monochromator
Independent Helium control: IHC Module dual 0010-07061 649A-14943
Transfer chamber:
Robot type: VHP Dual blade robot
General function:
Wafer out of position detection: LCF Sensor
Loadlock chamber:
SWLL Body: LLA/B A(0040-87833), B(0040-87834)
EFEM:
(3) TDK TAS-300 Load ports
Carrier ID reader: OMRON V640-HAM1 1-1
Air Intake system: (FFU)
Light curtain
YASKAWA 0190-14738 XU-RCM6841 FI Robot
YASKAWA XU-ACP4860 Wafer align
Wafer out of position detection: Blade finger sensor
Side storage: L
Remote interface:
Components interface:
Dry pump (transfer chamber) missing
Chiller missing
System monitor:
Monitor 1: Workstation 0246-00040
Components:
Turbo molecular pump:
TMP Model / Type: STP A2503PV
BOC EDWARDS PT43-56-000
RF Power:
Source RF generator:
APEX 3013 0920-00113
Frequency / Maximum power supply: 13.56 MHz / 3 kW
Bias RF generator:
APEX 1513 0920-00114
Frequency / Maximum power supply: 13.56 MHz / 1.5 kW
RF Match box:
0190-27576 3155132-001 Source
0190-15167 3155126-009 Bias
Utility:
Gas panel type: Next gen
Gas panel exhaust: Center exhaust
(12) Gas lines
Gas line tape heater (for liquid gas): BCL3 200 sccm
MFC Configuration:
MFC Type: Device net
MFC (All Chamber): UNIT IFC-125C
Gas information:
Gas / Gas name / SCCM
Gas 1 / CL2 / 200 SCCM
Gas 4 / CL2 / 300 SCCM
Gas 5 / 7% C2H4/HE / 400 SCCM
Gas 6 / SF6 / 400 SCCM
Gas 7 / O2 / 1000 SCCM
Gas 8 / CF4 / 50 SCCM
Gas 9 / AR / 400 SCCM
Gas 10 / CHF3 / 50 SCCM
Gas 12 / AR / 400 SCCM
Axiom chamber:
Gas / Gas name / SCCM
Gas 7 / O2 / 10000 SCCM
Gas 8 / CF4 / 300 SCCM
Gas 10 / N2 / 1000 SCCM
System controller:
FES: IBM 306 0090-23318
FIS: IBM 306 0090-22269
MF SBC: CL7
CCM SBC: 400 MHz
MF Controller:
Mainframe device net I/O: CDN494
AC Rack: Non remote UPS rack
Power supply: 208 V, 50/60 Hz, 3-Phase, 320 A
2006 vintage.
AMAT / APPLIED MATERIALS Centura DPS II Metal is a high-performance etch/ash equipment designed to etch and remove metal layers on semiconductor wafers. It offers a fast, low-temperature process that is capable of etching down to 1.5µm and is ideal for advanced chip fabrication. The DPS II Metal includes two Reactive Ion Etchers (RIE) and two Inductively Coupled Plasma (ICPC) processing chambers. The RIE chambers are designed to perform etch processes using ions, while the ICPC chambers are ideal for ash processes that use reactive elements. The system utilizes a high-powered Xenon lamp as a source of energy in order to perform etching and ashing at temperatures from 20° C to 250° C. A laser interferometric unit is used to measure the thickness of the layers and to provide feedback during the etching process. The machine provides high etch/ash accuracy and repeatability in order to achieve precise and reliable metal etching with a reduced cycle time. Its advanced software allows users to create program sequences and recipes to control the process parameters necessary to meet the exact requirements of each step, allowing for process optimization between layers. Additionally, the DPS II Metal features high speed electrical control to ensure efficient process performance. The tool is equipped with safety features such as safety interlocks, inert gas sensors, warning lights and alarms, all with the aim of prevent accidents. The asset is easy to operate and maintain with components that are accessible and replaceable ensuring long-term model reliability. AMAT Centura DPS II Metal is an advanced etch/ash equipment designed to provide precise metal etching for advanced chip fabrication. By using high-powered Xenon lamps and a laser interferometry system, it can achieve repeatable etch accuracy and support a wide range of process parameters. Its easy operation and maintenance, along with its many safety features makes it the ideal choice for a wide range of fabrication process steps.
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