Used AMAT / APPLIED MATERIALS Centura DPS II Metal #9288582 for sale

ID: 9288582
Wafer Size: 12"
Vintage: 2006
Metal etcher, 12" Chamber configuration: Chamber A: DPS II Metal Chamber C and D: ASP Process chamber: Process kits: DPS II Poly parts / Chamber Lid ESC Power supply: 0010-14630 HV Module Control type: TGV VAT 65050-PH52-AFS1 EOP Type: Monochromator Independent Helium control: IHC Module dual 0010-07061 649A-14943 Transfer chamber: Robot type: VHP Dual blade robot General function: Wafer out of position detection: LCF Sensor Loadlock chamber: SWLL Body: LLA/B A(0040-87833), B(0040-87834) EFEM: (3) TDK TAS-300 Load ports Carrier ID reader: OMRON V640-HAM1 1-1 Air Intake system: (FFU) Light curtain YASKAWA 0190-14738 XU-RCM6841 FI Robot YASKAWA XU-ACP4860 Wafer align Wafer out of position detection: Blade finger sensor Side storage: L Remote interface: Components interface: Dry pump (transfer chamber) missing Chiller missing System monitor: Monitor 1: Workstation 0246-00040 Components: Turbo molecular pump: TMP Model / Type: STP A2503PV BOC EDWARDS PT43-56-000 RF Power: Source RF generator: APEX 3013 0920-00113 Frequency / Maximum power supply: 13.56 MHz / 3 kW Bias RF generator: APEX 1513 0920-00114 Frequency / Maximum power supply: 13.56 MHz / 1.5 kW RF Match box: 0190-27576 3155132-001 Source 0190-15167 3155126-009 Bias Utility: Gas panel type: Next gen Gas panel exhaust: Center exhaust (12) Gas lines Gas line tape heater (for liquid gas): BCL3 200 sccm MFC Configuration: MFC Type: Device net MFC (All Chamber): UNIT IFC-125C Gas information: Gas / Gas name / SCCM Gas 1 / CL2 / 200 SCCM Gas 4 / CL2 / 300 SCCM Gas 5 / 7% C2H4/HE / 400 SCCM Gas 6 / SF6 / 400 SCCM Gas 7 / O2 / 1000 SCCM Gas 8 / CF4 / 50 SCCM Gas 9 / AR / 400 SCCM Gas 10 / CHF3 / 50 SCCM Gas 12 / AR / 400 SCCM Axiom chamber: Gas / Gas name / SCCM Gas 7 / O2 / 10000 SCCM Gas 8 / CF4 / 300 SCCM Gas 10 / N2 / 1000 SCCM System controller: FES: IBM 306 0090-23318 FIS: IBM 306 0090-22269 MF SBC: CL7 CCM SBC: 400 MHz MF Controller: Mainframe device net I/O: CDN494 AC Rack: Non remote UPS rack Power supply: 208 V, 50/60 Hz, 3-Phase, 320 A 2006 vintage.
AMAT / APPLIED MATERIALS Centura DPS II Metal is a high-performance etch/ash equipment designed to etch and remove metal layers on semiconductor wafers. It offers a fast, low-temperature process that is capable of etching down to 1.5µm and is ideal for advanced chip fabrication. The DPS II Metal includes two Reactive Ion Etchers (RIE) and two Inductively Coupled Plasma (ICPC) processing chambers. The RIE chambers are designed to perform etch processes using ions, while the ICPC chambers are ideal for ash processes that use reactive elements. The system utilizes a high-powered Xenon lamp as a source of energy in order to perform etching and ashing at temperatures from 20° C to 250° C. A laser interferometric unit is used to measure the thickness of the layers and to provide feedback during the etching process. The machine provides high etch/ash accuracy and repeatability in order to achieve precise and reliable metal etching with a reduced cycle time. Its advanced software allows users to create program sequences and recipes to control the process parameters necessary to meet the exact requirements of each step, allowing for process optimization between layers. Additionally, the DPS II Metal features high speed electrical control to ensure efficient process performance. The tool is equipped with safety features such as safety interlocks, inert gas sensors, warning lights and alarms, all with the aim of prevent accidents. The asset is easy to operate and maintain with components that are accessible and replaceable ensuring long-term model reliability. AMAT Centura DPS II Metal is an advanced etch/ash equipment designed to provide precise metal etching for advanced chip fabrication. By using high-powered Xenon lamps and a laser interferometry system, it can achieve repeatable etch accuracy and support a wide range of process parameters. Its easy operation and maintenance, along with its many safety features makes it the ideal choice for a wide range of fabrication process steps.
There are no reviews yet