Used AMAT / APPLIED MATERIALS Centura DPS II Poly #293820235 for sale

AMAT / APPLIED MATERIALS Centura DPS II Poly is an etcher and asher used in a variety of semiconductor fabrication processes. It is a state-of-the-art tool that combines wet chemical etching technology with dry resistive etching technology to enhance process efficiency and yield. AMAT Centura DPS II Poly etcher/asher can be used in both RIE (reactive ion etching) and DRIE (deep reactive ion etching) process steps. It is capable of processing wafers with a range of sizes up to 8" and with a variety of substrate materials including silicon, gallium arsenide, gallium nitride, and other III-V and II-VI materials. APPLIED MATERIALS Centura DPS II Poly etcher/asher is equipped with advanced features including an optimal plasma source, electrostatic chuck, wafer temperature control with two temperature zones, a non-invasive load lock, a two wand recirculation tank, and a remote shape generator. The optimal plasma source enables users to monitor and adjust the plasma parameters for improved process efficiency and yield. The electrostatic chuck provides precise and reliable wafer flatness to ensure uniform etching results. The wafer temperature control feature uses two temperature zones to ensure temperature uniformity within the etch chamber, thus promoting improved etching uniformity and repeatability. The non-invasive load lock helps to reduce contamination of the inside of the etcher removal chamber, as well as minimize particle generation and cross contamination between process steps. The two wand recirculation tank enables users to keep the process bath at an optimized temperature for better etching results. Lastly, the remote shape generator enables users to quickly generate the desired pattern geometry, providing an added level of control over the etching process. In summary, Centura DPS II Poly etcher/asher is a high-performing tool that provides advanced features which enables users to etch a variety of wafer sizes and materials for improved process efficiency and yield. Its optimal plasma source, electrostatic chuck, wafer temperature control with two temperature zones, a non-invasive load lock, a two wand recirculation tank, and a remote shape generator provides users with the tools to perform precise etching and ashing process steps with confidence.