Used AMAT / APPLIED MATERIALS Centura DPS Metal #9247622 for sale
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ID: 9247622
Wafer Size: 8"
Vintage: 2000
DPS Etcher, 8"
Wafer shape: SNNF
EMO Type
Chamber:
Chamber A, B: DPS Metal DTCU chamber
Chamber C, D: ASP+ Chamber
Chamber E: Cool down chamber
Chamber F: Orient chamber
Load lock:
Load lock type: Narrow body
Auto rotation
Cassette type, 8"
Mapping function: FWM
Fast vent option
Vent type: Variable speed
Mainframe:
Platform type: Centura II Etcher
Buffer robot type: VHP
Buffer robot blade: Standard metal
Status light tower
Remote monitor: Table mount
AGILENT / HP / HEWLETT-PACKARD / KEYSIGHT Buffer robot
No SMIF
(2) Chillers: HX-150 and Steelhead0
Gas panel configuration: VME1
EBARA ET800WS-A Turbo pump
NESLAB System II Heat exchanger
Front panel
Control rack
Local AC rack
Accessories
Cables
DPS R1 DTCU:
OEM-12B3 RF Generator type
GMW-25 RF Generator type
Gas panel configuration: VME1
EBARA ET800WS-A Turbo pump
Throttle valve
Endpoint: Monochromators
ASP+
Process control: Manometer
Microwave
Smart match
Magnetron head
Applicator
VDS Assembly
Sub-system:
(2) AMAT1 Chillers
(2) HX-150 Chillers
Electrical configuration:
Line voltage: 208 V
Full load current: 320 A
Frequency: 50/60 Hz
CE Marked
2000 vintage.
AMAT AMAT / APPLIED MATERIALS Centura DPS Metal is an advanced etcher/asher equipment that provides the highest levels of process control and throughput for precision applications such as MEMS and semiconductor devices. The system relies on a multi-frequency ICP source and an advanced dual-mode plasma-enhanced-chemical-vapor-deposition (PECVD) chamber to optimize the etching process. By providing consistently high yields, high reliability, and high throughput, AMAT Centura DPS Metal achieves excellent yields under a wide range of variables. APPLIED MATERIALS Centura DPS Metal is equipped with a range of features that allow users to achieve optimal process results. These features include automated pressure and temperature control, an effective plasma source, and a multistream delivery unit. Automated pressure and temperature control enables precise process control, which can be used to adjust process parameters for particular applications. In addition, the effective plasma source increases etching uniformity and improves etch selectivity. The multistream delivery machine ensures that the right gases and chemicals reach the chamber at the right concentrations. The tool can also perform a wide range of etch processes, such as selective wafer etching, dielectric etching, post CMP cleaning, and advanced photolithography. Each process is designed to take advantage of the asset's advanced plasma etching processes. Moreover, the model is able to etch all types of materials such as aluminum, carbon, silicon, and others. This wide range of process ability makes the equipment suitable for a variety of applications including micro cavities, MEMS, and semiconductor devices. Centura DPS Metal also offers excellent process uniformity. This uniformity ensures that all wafers are etched in a consistent manner, leading to consistent yields across the lot. Additionally, the system includes advanced process monitoring capabilities such as real-time visual monitoring and process gas flow control. This allows the user to view and monitor the process in detail, as well as providing control over the process. Overall, AMAT / APPLIED MATERIALS Centura DPS Metal provides an exceptional level of process control, allowing users to achieve high precision results no matter the circumstances. By providing advanced plasma etching, process uniformity, and control, the unit enables consistent and reliable results, making it the ideal etching solution for advanced and precision applications.
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