Used AMAT / APPLIED MATERIALS Centura DPS #293820215 for sale
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ID: 293820215
Metal etcher
Keyboard
(2) AMAT Heat exchangers
VHP-compatible robot with Fabworks End effectors
Vaporized Hydrogen Peroxide (VHP)
CHA and CHB Assemblies with VAT-TGV Pendulum valves
EBARA Pump interface
VME Rack
(2) PCs
Cart
(2) Monochromators
(2) LCD Monitors
Wall mounts
CENTURA Platform
Load locks
Umbilical cables
Wafer slide-out
Three-way switch
Coax cable
Pumps:
Etch chambers: EBARA A30W
ASP chambers: EBARA A70W
LL: EBARA A30W
Buffer chamber: EBARA A30W
Gases:
Chamber A: Cl₂ / BCl₃ / CHF₃ / Ar / N₂
Chamber B: Cl₂ / BCl₃ / CHF₃ / Ar / N₂
Chamber C: CF₄ / O₂ / N₂ / H₂O
Chamber D: CF₄ / O₂ / N₂ / H₂O.
AMAT / APPLIED MATERIALS DPS (Dry Plasma Equipment) is a high-performance etch/asher system designed for use in semiconductor fabrication applications. It is primarily used for dielectric and polysilicon etching as well as patterning, dopant deposition and oxygen ashing. AMAT DPS unit consists of a high-efficiency plasma chamber, a three-zone temperature adjustment machine, and a conformal gas-flow channeling tool. The etch/asher chamber is equipped with a plasma source and ion source, which are used to generate the plasma. Two gas inlets on the walls of the chamber are used to introduce the etch/asher gases to the plasma reaction zone. It also features an integrated exhaust asset and high-performance components for optimizing plasma performances. The precision three-zone temperature adjustment model in the chamber ensures uniform thermal distribution with minimal temperature fluctuation. The temperature ranges from -100°C to +200°C and can be varied depending on the application. The conformal gas-flow channeling equipment ensures uniformity of gas distribution. The gas is introduced at multiple points along the chamber walls, providing optimized etch/asher results. APPLIED MATERIALS DPS system features a wide range of control options. It has a user-friendly graphical user interface that provides full control over all parameters such as plasma pressure, gas flow, temperature and substrate bias. DPS unit has an advanced monitoring machine which allows users to analyze critical process parameters in real time. This ensures precise control over etch/asher processes. The tool is capable of handling a variety of substrate materials such as silicon, aluminum, titanium, copper, iron and deposited films such as copper and aluminum. It can be used in a variety of semiconductor fabrication processes, including metal oxide semiconductor (MOS) devices, silicon-on-insulator (SOI) devices, and multi-level interconnects. AMAT / APPLIED MATERIALS DPS etch/asher asset is an advanced model for etching and ashing processes that ensure high-quality results. With its precise control over etch rate and conformal gas-flow channeling, AMAT DPS equipment provides unparalleled process control over efficient etching and ashing processes. It is an ideal system for a wide range of semiconductor fabrication processes.
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