Used AMAT / APPLIED MATERIALS Centura DPS2 #293821386 for sale
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AMAT / APPLIED MATERIALS Centura DPS2 is a cutting-edge plasma etcher/asher instrument designed for precise and controlled etching and ashing processes in semiconductor manufacturing and research environments. This instrument is a part of the renowned Centura platform by AMAT, a leading provider of equipment, services, and software for the global semiconductor, display, and related industries. AMAT Centura DPS2 features advanced technologies and innovative design elements that enable high-performance processing while delivering exceptional process repeatability and uniformity. Equipped with multiple process chambers, APPLIED MATERIALS CENTURA DPS 2 offers flexibility to perform various etching and ashing processes on a wide range of substrates, including silicon wafers, compound semiconductors, and advanced materials used in the production of integrated circuits, MEMS devices, and other electronic components. The key components of CENTURA DPS 2 include process chambers, gas delivery systems, RF power sources, temperature control units, and vacuum systems, all integrated seamlessly to ensure optimal process performance and reliability. The equipment's chamber design and process control capabilities allow for precise control of plasma parameters, such as gas flow rates, pressure, power density, and substrate temperature, to achieve the desired etch selectivity, rate, and profile control. AMAT / APPLIED MATERIALS CENTURA DPS 2's plasma sources utilize advanced RF technology to generate plasma of various chemistries, such as fluorine-based and oxygen-based gases, to selectively etch or ash specific materials with high selectivity and resolution. The system's gas delivery unit is equipped with mass flow controllers and pressure regulation devices to ensure accurate gas mixing and flow control, critical for achieving the desired process results consistently. AMAT CENTURA DPS 2's temperature control units provide precise substrate heating and cooling capabilities to optimize process conditions for different types of materials and ensure uniform etch rates across the wafer. The machine's vacuum tool is designed to achieve and maintain the required process pressure levels for efficient plasma generation and substrate processing, while also facilitating fast chamber pumping and purging for rapid process cycle times. Centura DPS2 comes with a user-friendly interface and advanced process control software that allows operators to set up and monitor process parameters, analyze process data in real-time, and optimize process recipes for specific applications. The asset also offers advanced endpoint detection and chamber cleaning features to enhance process control, reduce downtime, and extend the model's maintenance intervals. In conclusion, APPLIED MATERIALS Centura DPS2 plasma etcher/asher is a state-of-the-art tool for advanced semiconductor manufacturing and research applications. With its cutting-edge technologies, superior process performance, and user-friendly interface, AMAT / APPLIED MATERIALS Centura DPS2 enables semiconductor manufacturers and researchers to achieve high-precision, reliable, and repeatable etching and ashing processes to meet the stringent requirements of the semiconductor industry.
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