Used AMAT / APPLIED MATERIALS Centura Enabler E5 #293617885 for sale

AMAT / APPLIED MATERIALS Centura Enabler E5
ID: 293617885
Wafer Size: 12"
Etcher, 12" (3) Chambers.
AMAT / APPLIED MATERIALS Centura Enabler E5 is an advanced etcher/asher that is used in semiconductor fabrication and packaging processes. It is capable of high-throughput and highly reliable etching of an array of materials. It includes a number of integrated features that are designed to maximize productivity and reduce costs. At its core, AMAT Centura Enabler E5 is a 300mm, chamber-based etcher/asher that is fully automated, using AMAT own CMx control system. The chamber can be utilized for both wet etching and plasma etching processes, making it ideal for both an array of advanced measures of device construction and for the device packaging that requires both wet and dry techniques. It is capable of etching silicon, gallium arsenide (GaAs) and other materials up to a depth of 250m in a single pass. It can also be used for a variety of other applications such as dicing, scribing, and stacking of multiple back-end wafer-level chip-scale packaging (Si WLCSP) devices. APPLIED MATERIALS Centura Enabler E5 also supports a variety of etching chemistries, including hydrofluoric acid (HF), ammonium bicarbonate (NH4HCO3), tetramethylammonium hydroxide (TMAH), phosphoric acid (H3PO4), sulfuric acid (H2SO4), and nitric acid (HNO3). Furthermore, the system is also capable of performing multi-step etch recipes using two wafer lanes, allowing for parallel etching of multiple wafers at the same time. The chamber also includes integrated safety features such as an automatic stop when the chlorine dioxide or nitrogen dioxide levels exceed a pre-set threshold. It is capable of operating at temperatures up to 150°C. In addition, the chamber has been designed to minimize the risk of contamination from back-side wafer particles. Overall, Centura Enabler E5 is an advanced etcher/asher that is designed for high-throughput and reliable etching of a variety of materials. It is capable of etching up to a depth of 250m in a single pass and for a variety of etching chemistries. Additionally, the system has a number of features designed to ensure safety, including an automatic stop when gas levels exceed a pre-set threshold, and it is able to operate at temperatures up to 150°.
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