Used AMAT / APPLIED MATERIALS DPS 532 #9044038 for sale

AMAT / APPLIED MATERIALS DPS 532 is an etcher/asher equipment that uses a low-pressure atmospheric plasma to deposit chemical layers or etch surfaces of semiconductor and other materials. The system's production-level design and state-of-the-art technology make it an easy-to-use, reliable tool for numerous applications. AMAT DPS 532 unit relies on a feature-rich, configurable, digital controller to carry out etching and deposition recipes. Internal components use a combination of plasma induced chemical vapor deposition (PICVD) and low-pressure capacitively coupled plasma (LPCP) for ions and radicals to initialize the process. The highly customizable recipes and sequencing parameters allow for great control over deposition and etching. A variety of gases, including O2, Argon, H2, SiH2Cl2, CF4, and NF3, are used to enhance etching and deposition rates and processes. APPLIED MATERIALS DPS 532 is capable of producing uniform etch rates and deposition of metals, polymers, and dielectrics in a wide range of materials with ease. Its large process chamber (10.2" diameter) ensures uniformity over wide areas. Additionally, the machine is equipped with advanced process monitoring capabilities, including a high-speed pyrometer to measure etch rates. These controls and performance measures ensure uniform results and uniformity on the platen. Furthermore, the LPCP etching process in DPS 532 is highly compatible with high-density etched features. The tool also utilizes a suite of online data acquisition tools and analysis to monitor etch and deposition rates in real time, ensuring part consistency and quality control. AMAT / APPLIED MATERIALS DPS 532's accuracy, repeatability, and flexibility make it perfect for production and development engineering needs. The asset is powered by a 480V, 3-phase power supply and has an operating temperature range of 10-40°C. In summary, AMAT DPS 532 is an extremely reliable etcher/asher model, combining advanced PICVD, LPCP, and RF sheath ionization techniques for precise and dependable performance. Its large working chamber, coupled with process control and monitoring capabilities, make it an invaluable tool for etching and depositing materials quickly and consistently.