Used AMAT / APPLIED MATERIALS DPS II AE G3 #9152529 for sale

AMAT / APPLIED MATERIALS DPS II AE G3
ID: 9152529
Poly etcher, 12" (3) Process chambers & AXIOM Factory interface: Front end PC type: 4.0 FEPC FIC PC Type: CPCI (3) Load ports A3 Type: Atmospheric robot KAWASAKI single fixed robot Side storage: Right and left Mainframe: IPUP Type: ALCATEL A100L Gas panel type: Standard VHP Robot: Dual blade MF PC Type: CL7 Chamber: Chamber A / B / C: Chamber model: DPS II Poly Bias gen: AE APEX 1513, 13.56 MHz Bias match: AE 13.56 MHz, 3kv navigation Source gen: AE APEX 3013, 13.56 MHz Source match: AE 13.56 MHz, 6 kv navigation Turbo pump: STP-A2703CV Throttle valve: VAT Pendulum valve DN-320 FRC: MKS FRCA-52163310 ESC: Dual zone ceramic ESC End point type: EyeD IEP AXIOM Chamber: RF Source: AE RAPID-OE PLASMA Sourse VODM: N/A Throttle valve: MKS 683 2006 vintage.
AMAT / APPLIED MATERIALS DPS II AE G3 is a high-performance, multi-application, multi-wafer etcher/asher equipment. It is designed to process a wide range of materials, including III-V compounds, silicon-on-insulator (SOI), metal-oxide-semiconductor (MOS), gallium arsenide (GaAs), indium phosphide (InP) and organic materials. It offers multiple etching technologies, including plasma-enhanced chemical vapor deposition (PECVD), reactive ion etching (RIE) and remote plasma cleaning (RPC), for advanced device fabrication. AMAT DPS II AE G3 ensures precise, repeatable, high- throughput etching of multiple, thin layers of materials and multiple devices on a single substrate. It offers advanced control systems for an accurate and precise process to produce tightly-controlled, high-quality structures for device fabrication. The machine uses a high-density inductively coupled plasma (ICP) source, which provides better etching selectivity, increased etch rates and improved uniformity. It is equipped with an enclosed Ultraflex® loader robot, which is capable of transferring parts of any size, shape, or weight. The system data is collected and monitored by a process feedback unit (P-Feedback), which offers real-time data logging, process numerical modeling and control. The data and machine performance is integrated with AMAT software platform, providing an automated tool of measurement, tracking and reporting of the etching and cleaning process. The software also includes a drag and drop recipe editor, on-the-fly process adjustability and other advanced features for user programmability and control. APPLIED MATERIALS DPS II AE G3 is designed to provide superior process control and repeatability, making it ideal for production environments. APPLIED MATERIALS DSPS II AE G3 is a powerful etcher/asher, ideal for high-performance and high-efficiency device fabrication. It offers a full suite of advanced features, designed to maximize throughput, reduce waste, while maintaining precision and repeatability in etching and cleaning processes. From single-wafer to multi-wafer etching, DPS II AE G3 is the perfect solution for advanced etching needs across a variety of applications.
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